At the recent TSMC OIP Symposium, Cadence's Tom Wong presented Sensor Fusion and ADAS SoC Designs in TSMC 16FFC and N7. These two processes are the "compact" 16nm process and the mainline 7nm process, two processes that TSMC selected for adding additional characterization and manufacturing tracking to support the automotive end-markets.
There are four big drivers in automotive electronics:
- 5G and DSRC (for V2x, and cloud communication)
- The growth of increasingly autonomous driving (broad level 2+ deployment)
- Vehicle electrification (2M in China, 1M in US, $100/kWh of battery)
- Smart mobility and ride-sharing (long term reliability)
In this post, I am going to use the term EV for electric vehicles. In China, these are called NEV, for new energy vehicle. Hybrids, whether chargeable or not, are also in there with similar requirements (along with the need for an internal combustion engine, which is not today's topic). I'm also going to assume you know your autonomous driving levels, and the tiered nature of the traditional automotive supply chain.
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