Industry Expert Blogs

The first blog in this series talked about the competitive benefits to differentiating OEM products in hardware as well as software, followed by a high-level view of our co-creation programs. In this blog I would like to talk a bit more about the way we at CEVA and Intrinsix approach collaboration with OEM and semiconductor, for a confident path to turnkey ASIC design or to wireless subsystem design. To illustrate, imagine the kind of SoC you might want to build for a wireless smart speaker or smart home entertainment system. Core to this system is an audio pipeline supporting voice processing for control commands and wireless connectivity through Wi-Fi and Bluetooth connectivity, where the BT connection could be for remote control or audio streaming. We also include on-chip RF for Bluetooth and WiFi. An overall block diagram is shown below.

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