Industry Expert Blogs

From the data center to the edge and deep within the web of smart everything, today’s advanced multi-die systems are achieving previously unheard-of levels of performance. Instead of one-size-fits-all monolithic silicon, multi-die systems are comprised of an array of heterogeneous dies (or “chiplets”), optimized for each functional component. But while multi-die systems offer new levels of flexibility and achievement in system power and performance, they also introduce a high degree of design complexity.

The Universal Chiplet Interconnect Express (UCIe) standard was introduced in March of 2022 to help standardize die-to-die connectivity in multi-die systems. UCIe can streamline interoperability between dies on different process technologies from various suppliers. But while your UCIe-compliant, multi-die system may work great through development, testing, and manufacturing, how will you ensure that your system’s die-to-die connectivity will continue—robust, secure, and tested— even while it’s operating in the field? Read on to explore requirements for enabling multi-die-system reliability with UCIe—through IP, test, emulation, and beyond.

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