Design & Reuse
Catalog of SIP Cores
System on Chip design resources
arrow Arithmetic & Mathematic (45)
arrow Embedded Memories (994)
arrow I/O Library (1032)
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2827 IP
151
10.0
Differential Output Buffer - TSMC N5
Analog Bits’ Differential Output Driver macros provide a low noise, high performance differential output clock. The output driver design implements a ...
152
10.0
Differential Receiver - TSMC 7FF
Analog Bits Differential Signal Receiver macro is a receiver including on-chip termination, and addresses a large portfolio of applications. The Recei...
153
10.0
Differential Signal Receiver - TSMC 6FF
Analog Bits Differential Signal Receiver macro is a receiver including on-chip termination, and addresses a large portfolio of applications. The Recei...
154
10.0
Differential Signal Receiver - TSMC N5
Analog Bits Differential Signal Receiver macro is a receiver including on-chip termination, and addresses a large portfolio of applications. The Recei...
155
10.0
4Kx16 Bits OTP (One-Time Programmable) IP, UM- 110 nm 1.2V/3.3V L110AE Process
The AT4K16U110MAE0DA is organized as a 4K-bits by 16 one-time programmable memory. This is a kind of non-volatile memory fabricated in UM- L110AE proc...
156
10.0
4Kx32 Bits OTP (One-Time Programmable) IP, TSM- 40nm ULP 1.1V/2.5V Process
The AT4K32T40ULP7ZC is organized as 4K-bits by 32 one-time programmable (OTP). This is a type of non-volatile memory fabricated in TSM- 40nm ULP stand...
157
10.0
4Kx8 Bits OTP (One-Time Programmable) IP, GLOBA-FOUNDR---® 22nm FDX 0.8V/1.8V Process
The AT4K8G22FDX0AA is organized as a 4K-bits by 8 one-time programmable memory. This is a kind of non-volatile memory fabricated in GLOBA-FOUNDR---® ...
158
10.0
8Kx8 Bits OTP (One-Time Programmable) IP, VI- 0.15µm 1.8V/5V BCD GIII Process
The AT8K8V150BCD0DB is organized as an 8K-bit by 8 one-time programmable (OTP). This is a kind of non-volatile memory fabricated in VI- 0.15μm BCD GII...
159
10.0
Glitch Detector - TSMC N5
Analog Bits’ Glitch Detector macro comprehensively addresses typical SOC power supply and other voltage glitch monitoring needs in a fully integrated ...
160
10.0
On-chip memory expansion
The Cache MX IP compresses on-chip L2, L3 SRAM cache enabling 2x effective capacity. SRAM Caches can take upto 30-50% of an SoC xPU silicon real estat...
161
10.0
ONFI 3.0 Compatible I/O Buffer - TSMC 28 CLN28HPM
Analog Bits ONFI 3.0 compatible I/O buffer provides a high-speed physical interface solution to support the increasing bandwidths demanded by today’s ...
162
10.0
eTCAM (28nm/16nm/12nm_Embedded Ternary Content Addressable Memory IP)
TCAM can search for data that matches the input in one cycle from all the information stored in the memory.If there are multiple matching data, it is ...
163
10.0
eTCAM (7nm_Embedded Ternary Content Addressable Memory IP)
TCAM can search for data that matches the input in one cycle from all the information stored in the memory.If there are multiple matching data, it is ...
164
10.0
LVDS IO handling data rate up to 50Mbps with maximum loading 60pF
KA16UGLVDS01ST001 is a LVDS IO handling data rate up to 50Mbps with a maximum loading of 60pF. The differential voltage swing can be programmable from...
165
10.0
1x64 Bits OTP (One-Time Programmable) IP, Globa-Foundr--- 22nmFDX 0.8V/1.8V Process
The AT1X64G22FDX0AA is organized as a 1 by 64 one-time programmable (OTP). This is a kind of non-volatile memory fabricated in Globa-Foundr--- 22nm FD...
166
8.0
Zero Additional Mask MTP
LEE Flash ZT (ZT) achieves automotive grade temperature and quality grade. Perfect fit for trimming and parameter storage in Sensor, Power and Analog...
167
8.0
Next Generation Flash device enabling small size, low power and direct connection with digital circuit which opens up new possibiities
LEE Flash G2 (G2) is an innovative Flash IP offering unique features that no other Flash IP could offer. It is based on LEE Flash G1, which consists ...
168
8.0
IGALVDT08B, TSMC CLN28HPM LVDS TX/RX Combo IO
The IGALVDT08B contain a differential driver (TX) and a re-ceiver (RX) for LVDS interface. It supports the data rate up to 1.5Gbps. There are four mac...
169
8.0
IGALVDV05A, TSMC CLN12FFC 6-Channel LVDS Transmitter PHY
IGALVDV05A is a 6-channel LVDS Transmitter PHY IP, which is used mainly in Flat-panel Display. It enables larger, higher resolution displays and lower...
170
8.0
IGMDLSX01A, TSMC CLN7FF High Speed Dual Port SRAM
IGMDLSX01A, TSMC CLN7FF High Speed Dual Port SRAM...
171
8.0
IGMSLSX01A, TSMC CLN7FF Low Power High Speed Single Port SRAM
IGMSLSX01A, TSMC CLN7FF Low Power High Speed Single Port SRAM...
172
8.0
Embedded flash IP, 1.32V/3V PSMC 90nm
LEE Flash G1 (G1) is based on simple SONOS architecture and capable to scale down to 40nm and supports auto grade temperature and quality. G1 is cos...
173
8.0
Embedded flash IP, 1.5V/5V 130BCD Plus
LEE Flash G1 (G1) is based on simple SONOS architecture and capable to scale down to 40nm . G1 is best fit embedded flash IP to BCD nodes and it can...
174
8.0
Embedded flash IP, 1.5V/5V 130nm
LEE Flash G1 (G1) is based on simple SONOS architecture and capable to scale down to 40nm and supports auto grade temperature and quality. G1 is cos...
175
8.0
TSMC CLN12FFC Ternary Content Addressable Memory Compiler
IGMTLSV04A is a synchronous LVT / ULVT periphery high-density ternary content addressable memory (TCAM). It is developed with TSMC 12nm 0.8V/1.8V CMOS...
176
8.0
TSMC CLN16FFC Ternary Content Addressable Memory
IGMTLSLV02A is a synchronous LVT periphery high-density ternary content addressable memory (TCAM). It is developed with TSMC 16 nm 0.8 V/1.8 V CMOS LO...
177
8.0
TSMC CLN5FF Ternary Content Addressable Memory Compiler with Column Redundancy
IGMTLSY01A is a synchronous LVTLL / LVT / ULVT periphery high-density ternary content addressable memory (TCAM) with column redundancy feature. It is ...
178
8.0
TSMC CLN5FFP Pre-search and Pipeline Ternary Content Addressable Memory
IGMTLSY02A, TSMC CLN5FFP Pre-search and Pipeline Ternary Content Addressable Memory...
179
8.0
TSMC CLN6FF Asynchronous Read Two Port Register File Compiler
IGMDLRX01A is an asynchronous read and synchronous write ULVT periphery two port register file compiler (2PRF). It is developed with TSMC 6nm 0.75V/1....
180
8.0
TSMC CLN7FF Pre-search and Pipeline Ternary Content Addressable Memory Compiler
IGMTLSX04A is a synchronous LVT / ULVT periphery high-density pre-search and pipeline ternary content addressable memory (TCAM) with column redundancy...
181
6.0
10-bit dual-port 30MHz ~ 85MHz LVDS Tx;
...
182
6.0
SMART - DSMART - ISO 7816 Based Smart Card Reader
The DSMART is a fast, versatile and cost-competitive core intended for smart card reader applications. It provides a communication interface with a sm...
183
6.0
LVDS 10 bits dual port transmitter
...
184
5.0556
A 2Gbps LVDS Tranceiver in TSMC 28nm
This 1.8V LVDS transceiver, designed for TSMCs 28nm process, delivers high-speed, low-power differential signaling with superior signal integrity. Eng...
185
5.0556
A 2Gbps SLVS Transceiver in TSMC 28nm
This 1.8V SLVS transceiver is a high-performance, low-power I/O solution optimized for TSMCs 28nm process. Designed with 1.8V thick oxide devices and ...
186
5.0556
A TSMC 16nm 2Gbps LVDS/SLVS Combo Transceiver
This combo transceiver is a highly configurable 2Gbps transceiver for LVDS or SLVS interfaces. With features like dynamic interface selection, on-die ...
187
5.0556
AD16: 1.8V/3.3V Flip-chip I/O Library with I2C ODIO & 5V HPD, TSMC 16nm
A production-quality, silicon-proven flip-chip I/O library in TSMC 16nm with multi-voltage GPIO (1.8V or 3.3V, dynamically selectable) and 4kV HBM ESD...
188
5.0556
WD28 / SC28: sub 80fF ESD Macro for multi-gigabit SerDes, TSMC 28nm
A silicon-proven, ultra-low-capacitance ESD macro in TSMC 28nm for multi-gigabit SerDes, available in wirebond (WD28) and flip-chip (SC28) variants. I...
189
5.0556
HDMI, LVDS, RF and Analog Pads Library in 45nm / 40nm in TSMC 45/40nm
A 1.0V to 5V Analog IO Library that includes an HDMI, LVDS, and Analog/RF Low Capacitance pad set in 45nm/40nm HPM processes. This library is a col...
190
5.0556
TE55: 0.9V/2.5V SoundWire audio I/O Library, TSMC 55nm LP
A silicon-proven 0.9V/2.5V in-line I/O library in TSMC 55nm LP, purpose-built as a SoundWire interface for high-performance, low-power audio. It provi...
191
5.0556
AF12: 1.8V/3.3V Flip-chip I/O library with I2C ODIO & 5V Hot-Plug Detect, TSMC 12nm
A production-quality, silicon-proven flip-chip I/O library in TSMC 12nm with multi-voltage GPIO (1.8V or 3.3V, dynamically selectable) and 4kV HBM ESD...
192
5.0556
UF16: Switchable 1.8V/3.3V GPIO Library with 5V ODIO, OTP & analog, TSMC 16nm
A flip-chip I/O library in TSMC 16nm (FFC/FFC+) that detects and dynamically adapts to a 1.8V or 3.3V VDDIO supply during operation. The GPIO configur...
193
5.0556
TF55: 0.9V/1.2V SoundWire audio I/O Library with auto-delay calibration, TSMC 55nm LP
A silicon-proven 0.9V/1.2V SoundWire I/O library in TSMC 55nm LP — the next-generation, lower-voltage companion to the 0.9V/2.5V TE55, with added auto...
194
5.0556
EG22: 1.8V/3.3V GPIO Library with 5V ODIO, HDMI, LVDS & analog cells, TSMC 22nm
A silicon-proven, inline flip-chip-compatible I/O library in TSMC 22nm with a two-speed GPIO (75MHz and 150MHz), 5V open-drain I/O, and dedicated HDMI...
195
5.0556
VG22: 1.8V/3.3V multi-voltage GPIO library with 5V ODIO & analog, TSMC 22nm
A silicon-proven inline wirebond I/O library in TSMC 22nm with dynamic 1.8V/3.3V multi-voltage GPIO (25/75/150MHz), 5V fail-safe open-drain I/O, and a...
196
5.0556
OG22: Three-speed 1.8V/3.3V GPIO Library with I2C ODIO, TSMC 22nm
A silicon-proven, inline flip-chip-compatible I/O library in TSMC 22nm with three speed-graded GPIOs (25/75/150MHz) and an I2C-compliant open-drain I/...
197
5.0556
TG28: Fail-Safe 1.8V/3.3V Multi-Voltage GPIO with embedded XTAL oscillator, TSMC 28nm
A silicon-proven, fail-safe digital I/O library in TSMC 28nm with a triple-staggered wirebond architecture supporting multi-voltage, multi-protocol GP...
198
5.0556
DG28: Switchable 1.8V/3.3V GPIO with 5V I2C ODIO, HDMI/LVDS protection, analog & OTP, TSMC 28nm
A silicon-proven, high-volume-production I/O library in TSMC 28nm (HPM/HPC/HPC+) that detects and dynamically adapts to a 1.8V or 3.3V VDDIO supply du...
199
5.0556
VG28: Switchable 1.8V/3.3V GPIO, TSMC 28nm
A silicon-proven, inline wirebond I/O library in TSMC 28nm that detects and dynamically adapts to a 1.8V or 3.3V VDDIO supply during operation. The GP...
200
5.0556
AJ65: I2C/I3C fail-safe GPIO wirebond digital & analog library, TSMC 65nm
A silicon-proven, mixed digital and analog wirebond I/O library in TSMC 65nm, built around a fail-safe GPIO (FSGPIO) cell with full I2C and I3C compli...