Design & Reuse
8 IP
1
10.0
UCIe based 8-bit 48-Gsps Transceiver (ADC/DAC/PLL/UCIe)
Unleash the power of the new UCIe based RF Chiplet transceiver. With NEXT Semiconductor's silicon proven 8-bit, 48-Gsps Transceiver, this product ...
2
5.0556
<4Gbps Low Power D2D Interface
Custom die-to-die interface in 12/16nm process technology. The I/O cells are defined as TX only, and RX only and have two modes of operation, standard...
3
14.0
40G Ultralink D2D PHY for GF12LP+
Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity The Cadence® UltraLink™ ...
4
14.0
40G Ultralink D2D PHY for Samsung 7LPP
Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity The Cadence® UltraLink™ ...
5
5.0556
600Mbps Low Power D2D Interface in 16nm
Custom die-to-die interface in 16nm process technology. The I/O cell is bi-directional and has two modes of operation: standard rail-to-rail swing or ...
6
5.0556
<4Gbps Low Power D2D Interface
Custom die-to-die high-speed interface in 28nm process technology. The I/O cells are defined as TX only, and RX only, and have two modes of operation,...
7
8.0
TSMC CLN6FF/7FF Die-to-Die Interface PHY
IGAD2DX01A is a high speed die-to-die interface PHY which transmits data through INFO RDL channels. IGAD2DX01A contains 32 Tx lanes and 32 Rx lanes pe...
8
0.0
XPHY Low power Chip to Chip SerDes IP, Silicon Proven in ST 28FDSOI
These IPs are targeted at applications requiring high speed, high bandwidth, low-power consumption, and low-latency interfaces....