Design & Reuse
5843 IP
1401
10.0
Temperature Sensor Non-Deep NWELL, TSMC N5
A high precision low power junction temperature sensor that has been developed to be easily embedded into digital ASIC designs. The block features an ...
1402
10.0
Temperature Sensor with Digital Output (High accuracy thermal sensing for reliability and optimisation)
A high precision low power junction temperature sensor that has been developed to be easily embedded into digital ASIC designs. The block features an ...
1403
10.0
Temperature Sensor with Digital Output (High accuracy thermal sensing for reliability and optimisation)
A high precision low power junction temperature sensor that has been developed to be easily embedded into digital ASIC designs. The block features an ...
1404
10.0
Temperature Sensor with Digital Output (High accuracy thermal sensing for reliability and optimisation), TSMC 12FFC
A high precision low power junction temperature sensor that has been developed to be easily embedded into digital ASIC designs. The block features an ...
1405
10.0
Temperature Sensor with Digital Output (High accuracy thermal sensing for reliability and optimisation), TSMC N6
A high precision low power junction temperature sensor that has been developed to be easily embedded into digital ASIC designs. The block features an ...
1406
10.0
Temperature Sensor with Digital Output High accuracy thermal sensing for reliability and optimisation)
A high precision low power junction temperature sensor that has been developed to be easily embedded into digital ASIC designs. The block features an ...
1407
10.0
Temperature Sensor with Digital Output High accuracy thermal sensing for reliability and optimisation)
A high precision low power junction temperature sensor that has been developed to be easily embedded into digital ASIC designs. The block features an ...
1408
10.0
Temperature Sensor with Digital Output High accuracy thermal sensing for reliability and optimisation)
A high precision low power junction temperature sensor that has been developed to be easily embedded into digital ASIC designs. The block features an ...
1409
10.0
Temperature Sensor with Digital Output High accuracy thermal sensing for reliability and optimisation), TSMC 16FFC
A high precision low power junction temperature sensor that has been developed to be easily embedded into digital ASIC designs. The block features an ...
1410
10.0
Performance-efficient, ultra-low power, compact ARC SEM security processors help protect against logical, hardware, physical and side-channel attacks
The Synopsys ARC® SEM Family of performance-efficient, ultra-low power, compact security processors enables designers to integrate security into their...
1411
10.0
VESA DSC Encoder and Decoder IP Solutions
Synopsys VESA Display Stream Compression (DSC) Encoder and Decoder IP provides a video compression solution for up to 10K ultra-high-definition displa...
1412
10.0
DesignWare Library contains the essential infrastructure IP for design and verification
The DesignWare Library contains the essential infrastructure IP for design and verification including datapath components, AMBA On-Chip Bus and microc...
1413
10.0
UFS Host Controller IP
Synopsys MIPI® IP solution enables low-power and high-performance interface between system-on-chips (SoCs), application processors, baseband processor...
1414
10.0
AHB Multi Fabric
The AHB Fabric provides the necessary infrastructure to connect up to 16 shared AHB Slaves to up to 16 AHB-Lite Bus Masters. The off-the-self configu...
1415
10.0
AHB QSPI Controller with Execute in Place (XIP)
The Quad Serial Peripheral Interface (OSPI) core is a serial data link (SPI) master which controls an external serial FLASH device. Reading and wri...
1416
10.0
Thermal Diode with Base Pin, TSMC 16FFC
Thermal diodes provide a useful means for monitoring junction temperature on die and are typically independently powered from the rest of the SoC. The...
1417
10.0
Thermal Diode with Base Pin, TSMC N3
Thermal diodes provide a useful means for monitoring junction temperature on die and are typically independently powered from the rest of the SoC. The...
1418
10.0
Thermal Diode with Base Pin, TSMC N3EP
Thermal diodes provide a useful means for monitoring junction temperature on die and are typically independently powered from the rest of the SoC. The...
1419
10.0
Thermal Diode with Base Pin, TSMC N4P
Thermal diodes provide a useful means for monitoring junction temperature on die and are typically independently powered from the rest of the SoC. The...
1420
10.0
Thermal Diode with Base Pin, TSMC N5
Thermal diodes provide a useful means for monitoring junction temperature on die and are typically independently powered from the rest of the SoC. The...
1421
10.0
Thermal Diode with Base Pin, TSMC N6
Thermal diodes provide a useful means for monitoring junction temperature on die and are typically independently powered from the rest of the SoC. The...
1422
10.0
Library of mathematical and floating point (FP) components
Optimized for efficient hardware implementation, the Synopsys Foundation Cores include a library of mathematical and floating point (FP) components th...
1423
10.0
Die-to-Die Controller IP
The Synopsys Die-to-Die Controller IP, optimized for latency, bandwidth, power and area, enables efficient inter-die connectivity in server, AI accele...
1424
10.0
Die-to-Die, 112G Ultra-Extra Short Reach PHY in GF (12nm)
The Synopsys XSR PHY IP for 112Gbps per lane die-to-die connectivity enables high-bandwidth ultra and extra short reach interfaces in multi-chip modul...
1425
10.0
Die-to-Die, 112G Ultra-Extra Short Reach PHY in TSMC (12nm, N7, N6, N5)
The Synopsys XSR PHY IP for 112Gbps per lane die-to-die connectivity enables high-bandwidth ultra and extra short reach interfaces in multi-chip modul...
1426
10.0
TileLink Target
TileLink is a chip-scale connection standard that enables many masters to have synchronised memory mapped access to memory and other slave devices. Ti...
1427
10.0
LIN Bus Master/Slave Controller Core
Implements a communication controller that transmits and receives complete Local Interconnect Network (LIN) frames to perform serial communication acc...
1428
10.0
MIPI C-PHY v1.2 D-PHY v2.1 RX 2 trios/2 Lanes in TSMC (16nm) for Automotive
Synopsys’ integrated C-PHY/D-PHY IP enables high-performance, low-power interface to SoCs, application processors, baseband processors, and peripheral...
1429
10.0
MIPI C-PHY v1.2 D-PHY v2.1 RX 3 trios/4 Lanes in TSMC (16nm, N7) for Automotive
Synopsys’ integrated C-PHY/D-PHY IP enables high-performance, low-power interface to SoCs, application processors, baseband processors, and peripheral...
1430
10.0
MIPI C-PHY v1.2 D-PHY v2.1 TX 2 trios/2 Lanes in TSMC (16nm) for Automotive
Synopsys’ integrated C-PHY/D-PHY IP enables high-performance, low-power interface to SoCs, application processors, baseband processors, and peripheral...
1431
10.0
MIPI C-PHY v1.2 D-PHY v2.1 TX 3 trios/4 Lanes in TSMC (16nm, N7, N5A, N3A)
Synopsys’ integrated C-PHY/D-PHY IP enables high-performance, low-power interface to SoCs, application processors, baseband processors, and peripheral...
1432
10.0
MIPI C-PHY v2.0 D-PHY v2.1 RX 2 trios/2 Lanes in TSMC (N5A, N3A)
Synopsys’ integrated C-PHY/D-PHY IP enables high-performance, low-power interface to SoCs, application processors, baseband processors, and peripheral...
1433
10.0
MIPI D-PHY TSMC 130nm
Arasan delivers you a MIPI D-PHY in the process node and lane configuration you need, conforming to your specific design constraints, with a complete ...
1434
10.0
MIPI D-PHY TSMC 28nm HPC+ @ 2.5Ghz
The Arasan’s MIPI D-PHY Analog Transceiver IP Core is fully compliant to the D-PHY specification version 1.1. It supports the MIPI® Camera Serial Inte...
1435
10.0
MIPI D-PHY Tx-Only 2 Lanes in TSMC (16nm, N7) for Automotive
Synopsys’ IP D-PHY IP enables high-performance, low-power interface to SoCs, application processors, baseband processors, and peripheral devices for m...
1436
10.0
MIPI D-PHY Tx-Only 4 Lanes in TSMC (16nm, N7) for Automotive
Synopsys’ IP D-PHY IP enables high-performance, low-power interface to SoCs, application processors, baseband processors, and peripheral devices for m...
1437
10.0
MIPI DSI-2 Transmit Controller v1.0
The Arasan DSI-2 Device Controller IP is designed to provide MIPI DSI-2 1.0 compliant high speed serial connectivity for mobile host processors using ...
1438
10.0
MIPI I3C Basic Secondary Controller
The I3C-SC core implements a versatile MIPI® Improved Inter Integrated Circuit (I3C) Secondary Controller core compliant with the latest MIPI I3C Basi...
1439
10.0
MIPI I3C PHY I/O
Arasan’s MIPI I3CⓇ PHY I/O IP, in compliance with MIPI I3CⓇ specifications v1.1. Arasan’s MIPI I3CⓇ PHY IP is part of Arasan’s Total IP Solution for M...
1440
10.0
MIPI M-PHY Designed For TSMC 28nm
ACS-AIP-MPHY-28HPM MIPI Specification Version 3.0 is a low pin count, power efficient, inter-chip serial interface with high bandwidth capabilities. A...
1441
10.0
MIPI M-PHY G4 Designed For TSMC 28nm HPC+
ACS-AIP-MPHY-28HPC+ MIPI Specification Version 4.1 is a low pin count, power efficient, inter-chip serial interface with high bandwidth capabilities. ...
1442
10.0
Wishbone Target
The Wishbone System-on-Chip (SoC) Interconnection Architecture for Portable IP Cores is a versatile design approach for semiconductor IP cores. Its go...
1443
10.0
Distributed Thermal Sensor (DTS) Deep NWELL, TSMC N3
The highly granular DTS offers a significant area reduction in comparison to some standard in-chip thermal sensor solutions and supports high accuracy...
1444
10.0
Distributed Thermal Sensor (DTS) Deep NWELL, TSMC N3EP
The highly granular DTS offers a significant area reduction in comparison to some standard in-chip thermal sensor solutions and supports high accuracy...
1445
10.0
Distributed Thermal Sensor (DTS) Deep NWELL, TSMC N4P
The highly granular DTS offers a significant area reduction in comparison to some standard in-chip thermal sensor solutions and supports high accuracy...
1446
10.0
Distributed Thermal Sensor (DTS) Deep NWELL, TSMC N5
The highly granular DTS offers a significant area reduction in comparison to some standard in-chip thermal sensor solutions and supports high accuracy...
1447
10.0
Distributed Thermal Sensor (DTS) Non Deep NWELL
The highly granular DTS offers a significant area reduction in comparison to some standard in-chip thermal sensor solutions and supports high accuracy...
1448
10.0
Distributed Thermal Sensor (DTS) Non Deep NWELL
The highly granular DTS offers a significant area reduction in comparison to some standard in-chip thermal sensor solutions and supports high accuracy...
1449
10.0
Distributed Thermal Sensor (DTS) Non Deep NWELL TSMC N6
The highly granular DTS offers a significant area reduction in comparison to some standard in-chip thermal sensor solutions and supports high accuracy...
1450
10.0
Distributed Thermal Sensor (DTS) Non-Deep NWELL, TSMC N3
The highly granular DTS offers a significant area reduction in comparison to some standard in-chip thermal sensor solutions and supports high accuracy...