Design & Reuse
5809 IP
1651
10.0
VESA DSC Encoder and Decoder IP Solutions
Synopsys VESA Display Stream Compression (DSC) Encoder and Decoder IP provides a video compression solution for up to 10K ultra-high-definition displa...
1652
10.0
UFS Host Controller IP
Synopsys MIPI® IP solution enables low-power and high-performance interface between system-on-chips (SoCs), application processors, baseband processor...
1653
10.0
AHB Multi Fabric
The AHB Fabric provides the necessary infrastructure to connect up to 16 shared AHB Slaves to up to 16 AHB-Lite Bus Masters. The off-the-self configu...
1654
10.0
AHB QSPI Controller with Execute in Place (XIP)
The Quad Serial Peripheral Interface (OSPI) core is a serial data link (SPI) master which controls an external serial FLASH device. Reading and wri...
1655
10.0
Thermal Diode with Base Pin, TSMC 16FFC
Thermal diodes provide a useful means for monitoring junction temperature on die and are typically independently powered from the rest of the SoC. The...
1656
10.0
Thermal Diode with Base Pin, TSMC N3
Thermal diodes provide a useful means for monitoring junction temperature on die and are typically independently powered from the rest of the SoC. The...
1657
10.0
Thermal Diode with Base Pin, TSMC N3EP
Thermal diodes provide a useful means for monitoring junction temperature on die and are typically independently powered from the rest of the SoC. The...
1658
10.0
Thermal Diode with Base Pin, TSMC N4P
Thermal diodes provide a useful means for monitoring junction temperature on die and are typically independently powered from the rest of the SoC. The...
1659
10.0
Thermal Diode with Base Pin, TSMC N5
Thermal diodes provide a useful means for monitoring junction temperature on die and are typically independently powered from the rest of the SoC. The...
1660
10.0
Thermal Diode with Base Pin, TSMC N6
Thermal diodes provide a useful means for monitoring junction temperature on die and are typically independently powered from the rest of the SoC. The...
1661
10.0
UHS-III PHY
Silicon Library's world-first silicon proven UHS-III PHY is available in SMIC65 now....
1662
10.0
Library of mathematical and floating point (FP) components
Optimized for efficient hardware implementation, the Synopsys Foundation Cores include a library of mathematical and floating point (FP) components th...
1663
10.0
Die-to-Die Controller IP
The Synopsys Die-to-Die Controller IP, optimized for latency, bandwidth, power and area, enables efficient inter-die connectivity in server, AI accele...
1664
10.0
Die-to-Die, 112G Ultra-Extra Short Reach PHY in GF (12nm)
The Synopsys XSR PHY IP for 112Gbps per lane die-to-die connectivity enables high-bandwidth ultra and extra short reach interfaces in multi-chip modul...
1665
10.0
Die-to-Die, 112G Ultra-Extra Short Reach PHY in TSMC (12nm, N7, N6, N5)
The Synopsys XSR PHY IP for 112Gbps per lane die-to-die connectivity enables high-bandwidth ultra and extra short reach interfaces in multi-chip modul...
1666
10.0
TileLink Target
TileLink is a chip-scale connection standard that enables many masters to have synchronised memory mapped access to memory and other slave devices. Ti...
1667
10.0
LIN Bus Master/Slave Controller Core
Implements a communication controller that transmits and receives complete Local Interconnect Network (LIN) frames to perform serial communication acc...
1668
10.0
MIPI C-PHY v1.2 D-PHY v2.1 RX 2 trios/2 Lanes in TSMC (16nm) for Automotive
Synopsys’ integrated C-PHY/D-PHY IP enables high-performance, low-power interface to SoCs, application processors, baseband processors, and peripheral...
1669
10.0
MIPI C-PHY v1.2 D-PHY v2.1 RX 3 trios/4 Lanes in TSMC (16nm, N7) for Automotive
Synopsys’ integrated C-PHY/D-PHY IP enables high-performance, low-power interface to SoCs, application processors, baseband processors, and peripheral...
1670
10.0
MIPI C-PHY v1.2 D-PHY v2.1 TX 2 trios/2 Lanes in TSMC (16nm) for Automotive
Synopsys’ integrated C-PHY/D-PHY IP enables high-performance, low-power interface to SoCs, application processors, baseband processors, and peripheral...
1671
10.0
MIPI C-PHY v1.2 D-PHY v2.1 TX 3 trios/4 Lanes in TSMC (16nm, N7, N5A, N3A)
Synopsys’ integrated C-PHY/D-PHY IP enables high-performance, low-power interface to SoCs, application processors, baseband processors, and peripheral...
1672
10.0
MIPI C-PHY v2.0 D-PHY v2.1 RX 2 trios/2 Lanes in TSMC (N5A, N3A)
Synopsys’ integrated C-PHY/D-PHY IP enables high-performance, low-power interface to SoCs, application processors, baseband processors, and peripheral...
1673
10.0
MIPI D-PHY TSMC 130nm
Arasan delivers you a MIPI D-PHY in the process node and lane configuration you need, conforming to your specific design constraints, with a complete ...
1674
10.0
MIPI D-PHY TSMC 28nm HPC+ @ 2.5Ghz
The Arasan’s MIPI D-PHY Analog Transceiver IP Core is fully compliant to the D-PHY specification version 1.1. It supports the MIPI® Camera Serial Inte...
1675
10.0
MIPI D-PHY Tx-Only 2 Lanes in TSMC (16nm, N7) for Automotive
Synopsys’ IP D-PHY IP enables high-performance, low-power interface to SoCs, application processors, baseband processors, and peripheral devices for m...
1676
10.0
MIPI D-PHY Tx-Only 4 Lanes in TSMC (16nm, N7) for Automotive
Synopsys’ IP D-PHY IP enables high-performance, low-power interface to SoCs, application processors, baseband processors, and peripheral devices for m...
1677
10.0
MIPI DSI-2 Transmit Controller v1.0
The Arasan DSI-2 Device Controller IP is designed to provide MIPI DSI-2 1.0 compliant high speed serial connectivity for mobile host processors using ...
1678
10.0
MIPI I3C Basic Secondary Controller
The I3C-SC core implements a versatile MIPI® Improved Inter Integrated Circuit (I3C) Secondary Controller core compliant with the latest MIPI I3C Basi...
1679
10.0
MIPI I3C PHY I/O
Arasan’s MIPI I3CⓇ PHY I/O IP, in compliance with MIPI I3CⓇ specifications v1.1. Arasan’s MIPI I3CⓇ PHY IP is part of Arasan’s Total IP Solution for M...
1680
10.0
MIPI M-PHY Designed For TSMC 28nm
ACS-AIP-MPHY-28HPM MIPI Specification Version 3.0 is a low pin count, power efficient, inter-chip serial interface with high bandwidth capabilities. A...
1681
10.0
MIPI M-PHY G4 Designed For TSMC 28nm HPC+
ACS-AIP-MPHY-28HPC+ MIPI Specification Version 4.1 is a low pin count, power efficient, inter-chip serial interface with high bandwidth capabilities. ...
1682
10.0
Wishbone Target
The Wishbone System-on-Chip (SoC) Interconnection Architecture for Portable IP Cores is a versatile design approach for semiconductor IP cores. Its go...
1683
10.0
Distributed Thermal Sensor (DTS) Deep NWELL, TSMC N3
The highly granular DTS offers a significant area reduction in comparison to some standard in-chip thermal sensor solutions and supports high accuracy...
1684
10.0
Distributed Thermal Sensor (DTS) Deep NWELL, TSMC N3EP
The highly granular DTS offers a significant area reduction in comparison to some standard in-chip thermal sensor solutions and supports high accuracy...
1685
10.0
Distributed Thermal Sensor (DTS) Deep NWELL, TSMC N4P
The highly granular DTS offers a significant area reduction in comparison to some standard in-chip thermal sensor solutions and supports high accuracy...
1686
10.0
Distributed Thermal Sensor (DTS) Deep NWELL, TSMC N5
The highly granular DTS offers a significant area reduction in comparison to some standard in-chip thermal sensor solutions and supports high accuracy...
1687
10.0
Distributed Thermal Sensor (DTS) Non Deep NWELL
The highly granular DTS offers a significant area reduction in comparison to some standard in-chip thermal sensor solutions and supports high accuracy...
1688
10.0
Distributed Thermal Sensor (DTS) Non Deep NWELL
The highly granular DTS offers a significant area reduction in comparison to some standard in-chip thermal sensor solutions and supports high accuracy...
1689
10.0
Distributed Thermal Sensor (DTS) Non Deep NWELL TSMC N6
The highly granular DTS offers a significant area reduction in comparison to some standard in-chip thermal sensor solutions and supports high accuracy...
1690
10.0
Distributed Thermal Sensor (DTS) Non-Deep NWELL, TSMC N3
The highly granular DTS offers a significant area reduction in comparison to some standard in-chip thermal sensor solutions and supports high accuracy...
1691
10.0
Distributed Thermal Sensor (DTS) Non-Deep NWELL, TSMC N3EP
The highly granular DTS offers a significant area reduction in comparison to some standard in-chip thermal sensor solutions and supports high accuracy...
1692
10.0
Distributed Thermal Sensor (DTS) Non-Deep NWELL, TSMC N4P
The highly granular DTS offers a significant area reduction in comparison to some standard in-chip thermal sensor solutions and supports high accuracy...
1693
10.0
Distributed Thermal Sensor (DTS) Non-Deep NWELL, TSMC N5
The highly granular DTS offers a significant area reduction in comparison to some standard in-chip thermal sensor solutions and supports high accuracy...
1694
10.0
Ultra High Performance AES-XTS/ECB Core
The proliferation and expansion of connected devices, connectivity infrastructure, cloud computing, and artificial intelligence is driving for increas...
1695
10.0
Ultra High-Performance AES-GCM/CTR IP
The proliferation and expansion of connected devices, connectivity infrastructure, cloud computing, and artificial intelligence is driving for increas...
1696
10.0
AMBA AHB Target
AMBA AHB is a bus interface designed for high-performance synthesizable applications. It specifies the interface between components such as initiator ...
1697
10.0
AMBA APB Target
Advanced Peripheral Bus (APB) is one of the Advanced Microcontroller Bus Architecture (AMBA) family protocols. It is a low-cost interface that is desi...
1698
10.0
AMBA AXI Target
The "advanced extensible interface" (AXI) bus is a high-performance parallel bus that connects on-chip peripheral circuits (or IP blocks) to processor...
1699
10.0
VME System Controller with AXI4 compliant user interface
The VMESCmodule2 is a VME System Controller core designed for FPGA and ASIC integrations. The core contains VME Slave and Master functions as well as ...
1700
10.0
VME System Controller with AXI4 user interface and 2eSST support
The VMESCmodule2e is a VME System Controller core designed for FPGA and ASIC integrations. The core contains VME Slave and Master functions as well as...