Design & Reuse
5343 IP
251
10.0
DDR4 multiPHY in TSMC (28nm)
The Synopsys DDR4 multiPHY is a complete physical (PHY) layer IP interface solution for PC/consumer and mobile ASICs, ASSPs, system-on- chip (SoC), an...
252
10.0
DDR4 multiPHY in UMC (28nm)
The Synopsys DDR4 multiPHY is a complete physical (PHY) layer IP interface solution for PC/consumer and mobile ASICs, ASSPs, system-on- chip (SoC), an...
253
10.0
DDR4/3 PHY in Samsung (14nm, 11nm, 10nm, 8nm)
The Synopsys DDR4/3 PHY is a complete physical layer IP interface (PHY) solution for enterprise-class ASIC, ASSP, and system-on-chip (SoC) application...
254
10.0
DDR4/3 PHY in TSMC (12nm, 16nm, 7nm)
The Synopsys DDR4/3 PHY is a complete physical layer IP interface (PHY) solution for enterprise-class ASIC, ASSP, and system-on-chip (SoC) application...
255
10.0
DDR5 PHY in Samsung (SF2, SF4X)
The Synopsys DDR5/4 PHY is a complete physical layer IP interface (PHY) solution for ASIC, ASSP, and system-on-chip (SoC) applications requiring high-...
256
10.0
DDR5/4 PHY in GF (12nm)
The Synopsys DDR5/4 PHY is a complete physical layer IP interface (PHY) solution for ASIC, ASSP, and system-on-chip (SoC) applications requiring high-...
257
10.0
DDR5/4 PHY in Samsung (10nm, 8nm, 7nm)
The Synopsys DDR5/4 PHY is a complete physical layer IP interface (PHY) solution for ASIC, ASSP, and system-on-chip (SoC) applications requiring high-...
258
10.0
DDR5/4 PHY in TSMC (16nm, 12nm, N6, N7, N5)
The Synopsys DDR5/4 PHY is a complete physical layer IP interface (PHY) solution for ASIC, ASSP, and system-on-chip (SoC) applications requiring high-...
259
10.0
DDR5/4 PHY V2 in TSMC (N7, N6, N4C, N5)
The Synopsys DDR5/4 PHY is a complete physical layer IP interface (PHY) solution for ASIC, ASSP, and system-on-chip (SoC) applications requiring high-...
260
10.0
Secure Boot Software Development Kit
Secure boot enhances the security of an embedded system by cryptographically verifying that the code being loaded and executed is authentic and has no...
261
10.0
Security Protocol Accelerator for SM3 and SM4
SM3 and SM4 are commercial cryptographic standards issued and regulated by the Chinese Office of State Commercial Cryptography Administration (OSCCA)...
262
10.0
Temperature Sensor Non-Deep NWELL, TSMC N3
A high precision low power junction temperature sensor that has been developed to be easily embedded into digital ASIC designs. The block features an ...
263
10.0
Temperature Sensor Deep NWELL, TSMC N3
A high precision low power junction temperature sensor that has been developed to be easily embedded into digital ASIC designs. The block features an ...
264
10.0
Temperature Sensor Deep NWELL, TSMC N4P
A high precision low power junction temperature sensor that has been developed to be easily embedded into digital ASIC designs. The block features an ...
265
10.0
Temperature Sensor Deep NWELL, TSMC N5
A high precision low power junction temperature sensor that has been developed to be easily embedded into digital ASIC designs. The block features an ...
266
10.0
Temperature Sensor Non-Deep NWELL, TSMC N3EP
A high precision low power junction temperature sensor that has been developed to be easily embedded into digital ASIC designs. The block features an ...
267
10.0
Temperature Sensor Non-Deep NWELL, TSMC N4P
A high precision low power junction temperature sensor that has been developed to be easily embedded into digital ASIC designs. The block features an ...
268
10.0
Temperature Sensor Non-Deep NWELL, TSMC N5
A high precision low power junction temperature sensor that has been developed to be easily embedded into digital ASIC designs. The block features an ...
269
10.0
Temperature Sensor with Digital Output (High accuracy thermal sensing for reliability and optimisation)
A high precision low power junction temperature sensor that has been developed to be easily embedded into digital ASIC designs. The block features an ...
270
10.0
Temperature Sensor with Digital Output (High accuracy thermal sensing for reliability and optimisation)
A high precision low power junction temperature sensor that has been developed to be easily embedded into digital ASIC designs. The block features an ...
271
10.0
Temperature Sensor with Digital Output (High accuracy thermal sensing for reliability and optimisation), TSMC 12FFC
A high precision low power junction temperature sensor that has been developed to be easily embedded into digital ASIC designs. The block features an ...
272
10.0
Temperature Sensor with Digital Output (High accuracy thermal sensing for reliability and optimisation), TSMC N6
A high precision low power junction temperature sensor that has been developed to be easily embedded into digital ASIC designs. The block features an ...
273
10.0
Temperature Sensor with Digital Output High accuracy thermal sensing for reliability and optimisation)
A high precision low power junction temperature sensor that has been developed to be easily embedded into digital ASIC designs. The block features an ...
274
10.0
Temperature Sensor with Digital Output High accuracy thermal sensing for reliability and optimisation)
A high precision low power junction temperature sensor that has been developed to be easily embedded into digital ASIC designs. The block features an ...
275
10.0
Temperature Sensor with Digital Output High accuracy thermal sensing for reliability and optimisation)
A high precision low power junction temperature sensor that has been developed to be easily embedded into digital ASIC designs. The block features an ...
276
10.0
Temperature Sensor with Digital Output High accuracy thermal sensing for reliability and optimisation), TSMC 16FFC
A high precision low power junction temperature sensor that has been developed to be easily embedded into digital ASIC designs. The block features an ...
277
10.0
Performance-efficient, ultra-low power, compact ARC SEM security processors help protect against logical, hardware, physical and side-channel attacks
The Synopsys ARC® SEM Family of performance-efficient, ultra-low power, compact security processors enables designers to integrate security into their...
278
10.0
VESA DSC Encoder and Decoder IP Solutions
Synopsys VESA Display Stream Compression (DSC) Encoder and Decoder IP provides a video compression solution for up to 10K ultra-high-definition displa...
279
10.0
DesignWare Library contains the essential infrastructure IP for design and verification
The DesignWare Library contains the essential infrastructure IP for design and verification including datapath components, AMBA On-Chip Bus and microc...
280
10.0
UFS Host Controller IP
Synopsys MIPI® IP solution enables low-power and high-performance interface between system-on-chips (SoCs), application processors, baseband processor...
281
10.0
Thermal Diode with Base Pin, TSMC 16FFC
Thermal diodes provide a useful means for monitoring junction temperature on die and are typically independently powered from the rest of the SoC. The...
282
10.0
Thermal Diode with Base Pin, TSMC N3
Thermal diodes provide a useful means for monitoring junction temperature on die and are typically independently powered from the rest of the SoC. The...
283
10.0
Thermal Diode with Base Pin, TSMC N3EP
Thermal diodes provide a useful means for monitoring junction temperature on die and are typically independently powered from the rest of the SoC. The...
284
10.0
Thermal Diode with Base Pin, TSMC N4P
Thermal diodes provide a useful means for monitoring junction temperature on die and are typically independently powered from the rest of the SoC. The...
285
10.0
Thermal Diode with Base Pin, TSMC N5
Thermal diodes provide a useful means for monitoring junction temperature on die and are typically independently powered from the rest of the SoC. The...
286
10.0
Thermal Diode with Base Pin, TSMC N6
Thermal diodes provide a useful means for monitoring junction temperature on die and are typically independently powered from the rest of the SoC. The...
287
10.0
Library of mathematical and floating point (FP) components
Optimized for efficient hardware implementation, the Synopsys Foundation Cores include a library of mathematical and floating point (FP) components th...
288
10.0
Die-to-Die Controller IP
The Synopsys Die-to-Die Controller IP, optimized for latency, bandwidth, power and area, enables efficient inter-die connectivity in server, AI accele...
289
10.0
Die-to-Die, 112G Ultra-Extra Short Reach PHY in GF (12nm)
The Synopsys XSR PHY IP for 112Gbps per lane die-to-die connectivity enables high-bandwidth ultra and extra short reach interfaces in multi-chip modul...
290
10.0
Die-to-Die, 112G Ultra-Extra Short Reach PHY in TSMC (12nm, N7, N6, N5)
The Synopsys XSR PHY IP for 112Gbps per lane die-to-die connectivity enables high-bandwidth ultra and extra short reach interfaces in multi-chip modul...
291
10.0
MIPI C-PHY v1.2 D-PHY v2.1 RX 2 trios/2 Lanes in TSMC (16nm) for Automotive
Synopsys’ integrated C-PHY/D-PHY IP enables high-performance, low-power interface to SoCs, application processors, baseband processors, and peripheral...
292
10.0
MIPI C-PHY v1.2 D-PHY v2.1 RX 3 trios/4 Lanes in TSMC (16nm, N7) for Automotive
Synopsys’ integrated C-PHY/D-PHY IP enables high-performance, low-power interface to SoCs, application processors, baseband processors, and peripheral...
293
10.0
MIPI C-PHY v1.2 D-PHY v2.1 TX 2 trios/2 Lanes in TSMC (16nm) for Automotive
Synopsys’ integrated C-PHY/D-PHY IP enables high-performance, low-power interface to SoCs, application processors, baseband processors, and peripheral...
294
10.0
MIPI C-PHY v1.2 D-PHY v2.1 TX 3 trios/4 Lanes in TSMC (16nm, N7, N5A, N3A)
Synopsys’ integrated C-PHY/D-PHY IP enables high-performance, low-power interface to SoCs, application processors, baseband processors, and peripheral...
295
10.0
MIPI C-PHY v2.0 D-PHY v2.1 RX 2 trios/2 Lanes in TSMC (N5A, N3A)
Synopsys’ integrated C-PHY/D-PHY IP enables high-performance, low-power interface to SoCs, application processors, baseband processors, and peripheral...
296
10.0
MIPI D-PHY Tx-Only 2 Lanes in TSMC (16nm, N7) for Automotive
Synopsys’ IP D-PHY IP enables high-performance, low-power interface to SoCs, application processors, baseband processors, and peripheral devices for m...
297
10.0
MIPI D-PHY Tx-Only 4 Lanes in TSMC (16nm, N7) for Automotive
Synopsys’ IP D-PHY IP enables high-performance, low-power interface to SoCs, application processors, baseband processors, and peripheral devices for m...
298
10.0
Distributed Thermal Sensor (DTS) Deep NWELL, TSMC N3
The highly granular DTS offers a significant area reduction in comparison to some standard in-chip thermal sensor solutions and supports high accuracy...
299
10.0
Distributed Thermal Sensor (DTS) Deep NWELL, TSMC N3EP
The highly granular DTS offers a significant area reduction in comparison to some standard in-chip thermal sensor solutions and supports high accuracy...
300
10.0
Distributed Thermal Sensor (DTS) Deep NWELL, TSMC N4P
The highly granular DTS offers a significant area reduction in comparison to some standard in-chip thermal sensor solutions and supports high accuracy...