Design & Reuse
Catalog of SIP Cores
System on Chip design resources

VR13: Radiation-hardened wirebond I/O library with 3.3V GPIO, LVDS, I2C ODIO, analog & OTP, TSMC 130nm

A silicon-proven, radiation-hardened wirebond I/O library in TSMC 130nm, rated for an extended −50°C to 200°C range with sleep-retention and a built-i...