FSA and IEE Announce 2005 IEE/FSA International Semiconductor Executive Forum
Event Includes Inaugural 2005 FSA Suppliers Expo EUROPE
SAN JOSE, Calif. (March 29, 2005) – FSA, voice of the global fabless business model, and the IEE, Europe's largest group of professional engineers, announce the 2005 FSA Suppliers Expo EUROPE and IEE/FSA International Semiconductor Executive Forum will be held May 11 – 12, 2005 at the Mermaid Conference and Events Centre in London.
The second annual Forum brings together executives from the entire semiconductor industry, including fabless, foundry, test and packaging companies; EDA tool vendors; integrated device manufacturers (IDMs); investment bankers and venture capitalists. The Forum will focus on challenges and opportunities with business in Asia, the automotive industry, end market strategies and global competitiveness.
Underscoring the importance of this event, Sir Robin Saxby, chairman of ARM Holdings plc and a keynote speaker at last year’s event, said, “The IEE and FSA successfully brought together the leading semiconductor industry executives from around the globe to converge on London, to review and discuss developments in this highly innovative and fast changing industry which shapes and influences all of our lives.”
“Last year’s event was excellent. The high quality conference agenda attracts a significant number of senior attendees from Europe, North America and Asia,” said Jim Tully, vice president of research, semiconductors at Gartner. “A lot of excitement is generated in the conference sessions, producing much discussion and debate during the breaks. This is a world-class networking event.”
FSA will also host its first 2005 FSA Suppliers Expo EUROPE on May 12, following on the success of its exhibitions in the United States and Taiwan. The Expo provides an opportunity for all European semiconductor professionals to attend a complimentary exhibition featuring industry suppliers from across the globe to explore their latest, most innovative products and services.
Platinum sponsors include 3i, Agilent Technologies, and TSMC.
For additional information, please visit http://www.fsa.org/suppliers_expo/europe/.
About the IEE:
Founded in 1871, the IEE (The Institution of Electrical Engineers) is Europe's largest group of professional engineers and has some 130,000 members worldwide, and more than 700 affiliated companies. Members range from students to leading figures in industry, research and development and education working in communications technology, electronics, power engineering, computing, software, control, informatics and manufacturing. For more information about the IEE visit www.iee.org.
About FSA:
FSA is the voice of the global fabless business model. Incorporated in 1994, FSA positively impacts the growth and return on invested capital of this business model to enhance the environment for innovation. It provides a platform for meaningful global collaboration between fabless companies and their partners; provides timely research and resources; and identifies, debates, and discusses business and technical issues. Members include fabless companies and their supply chain and service partners, representing more than 21 countries across the globe. www.fsa.org.
|
Related News
- FSA and IEE Announce Keynotes for IEE/FSA International Semiconductor Executive Forum
- Fabless Semiconductor Association (FSA) Announces 2005 Board Of Directors
- EdgeCortix Expands Leadership Team with Semiconductor Industry Veteran Tim Vehling as Executive Vice President of Global Sales
- The Six Semiconductor of OPENEDGES Receives Best International Business Award from ACCE
- Semiconductor Manufacturing International Corporation Responses to Media on the U.S. Government's Consideration to Add the Company to a Trade Blacklist
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |