Multi Protocol Endpoint IP Core for Safe and Secure Ethernet Network
Xilinx Ships Virtex-4 LX200: World's Highest Density FPGA
April 1, 2005 -- Xilinx, Inc. (NASDAQ: XLNX) today announced the immediate availability of its Virtex-4™ LX200 device - the world’s highest density FPGA. With over 200,000 logic cells, the LX200 has 30 percent more logic capacity than the closest competing FPGA. In addition to logic, the device features a host of unique embedded IP functions such as built-in FIFO control logic and dedicated circuitry for memory and source synchronous interfaces in every I/O cell which dramatically boost the effective logic density. The LX200 also provides the industry’s highest performance, while reducing power by as much as 5 Watts and simultaneously switching output (SSO) noise and crosstalk by 7 times compared to competing 90nm FPGAs. With these capabilities, the LX200 device builds on the company’s vast experience in delivering industry-leading device densities, providing practical solutions for the tough challenges of high-density, high-performance FPGA and ASIC applications.
The Virtex-4 LX200 FPGA provides:
- 200,448 logic cells, 30 percent more logic resources than the closest competitor
- 15 percent faster fabric on average than the closest competing 90nm FPGA
- 6,048 Kbits of 500 MHz block RAM with unique built-in FIFO control logic and ECC for highest performance and lowest power consumption
- 96 XtremeDSP™ slices, each supporting 500 MHz 18x18 multiply and accumulate (MAC) operations while consuming a mere 2.3 mW/100 MHz
- Up to 960 I/Os (448 differential pairs) with unique ChipSync™ source-synchronous circuitry in every I/O
- Hardware-proven support for all major memory interfaces including DDR2 SDRAM, DDR SDRAM, QDR II SRAM, and RLDRAM II
- As much as 5 Watts lower power per FPGA compared to competing 90nm FPGAs as a result of unique triple-oxide technology and embedded IP
- Up to 7 times less simultaneously switching outputs (SSO) noise and crosstalk compared as to competing FPGAs (as demonstrated by independent industry expert Dr. Howard Johnson)
Virtex-4 FPGA Availability
The Virtex-4 LX25, LX60, LX100, LX200, SX25, SX35, SX55, and FX12 FPGAs are shipping today. Xilinx now has a total of 20 FPGAs shipping at 90nm – three times as many 90nm FPGAs as its nearest competitor.
Xilinx e-Newsletter
Register now at www.xilinx.com/virtex4 to receive Virtex-4 product updates via the Xilinx e-Newsletter.
About Xilinx Virtex-4 Platform FPGAs
Named 2004 Product of the Year by Electronic Products Magazine, Xilinx Virtex-4 FPGAs deliver more options, higher performance and lower power than any other FPGA family available today. With more than 100 technical innovations, the Virtex-4 family consists of 17 devices and three domain-optimized platforms; Virtex-4 LX FPGAs optimized for logic-intensive designs, Virtex-4 SX FPGAs optimized for high-performance signal processing, and Virtex-4 FX FPGAs optimized for high-speed serial connectivity and embedded processing. A multi-platform approach makes it possible for customers to select the optimal mix of resources for their application to achieve the highest functionality and breakthrough performance at the lowest cost. Devices are shipping now. For more information on the Virtex-4 product family, visit www.xilinx.com/virtex4.
About Xilinx
Xilinx is the worldwide leader in complete programmable logic solutions. For more information, visit www.xilinx.com.
|
Xilinx, Inc. Hot IP
Related News
- Xilinx Ships Virtex-4 SX55 - World's Fastest FPGA For DSP
- PLDA's XpressFX Prototyping Platform, Based on the Xilinx Virtex-4 FX FPGA, Achieves Record Sales
- Xilinx Ships New Virtex-4 FX12 FPGA
- Xilinx Unveils Virtex-4 Family - Industry's First Multi-Platform FPGA
- Tensilica Adds Support for High-Speed, Hardware-Based Processor Simulations Using Avnet’s Xilinx Virtex-4 LX200 Development Kit
Breaking News
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
E-mail This Article | Printer-Friendly Page |