Complete measurement subsystem IP for single phase power metering
Austria's NewLogic receives certification for Bluetooth IP cores
![]() |
Austria's NewLogic receives certification for Bluetooth IP cores
By Semiconductor Business News
January 3, 2001 (2:18 p.m. EST)
URL: http://www.eetimes.com/story/OEG20010103S0018
LUSTENAU, Austria -- Austria's NewLogic Technologies AG here announced it has completed the qualification phase of its intellectual-property (IP) cores for Bluetooth-enabled applications. This is believed to be the first Bluetooth-based IP cores to be certified in the market, enabling them to interoperate with other chips and systems in this arena, said Gianmaria Mazzucchelli, managing director of NewLogic. NewLogic offers three Bluetooth-based IP cores. The company's Boost family of IP products include a software protocol stack and a CMOS-based radio-frequency (RF) device. These IP elements, when combined with a suitable microcontroller core, permit theimplementation of a single chip Bluetooth solution using industry standard CMOS process technologies. "Our Boost IP products enable designers to integrate Bluetooth functionality into their ASIC and ASSP based products with a minimum of risk," said Hans-Peter Metzler, president and chief executive of NewLogic.
Related News
- Imagination's Ensigma communications IP receives Wi-Fi CERTIFIED ac certification and Bluetooth Smart qualification
- Bluetooth Baseband Controller from MindTree Consulting receives BQB certification
- Gowin Semiconductor Adds Korea Certification For Their Bluetooth Low Energy Enabled MSoC FPGA Modules
- Lattice MachXO3D Secure Control FPGA Receives Security Certification from NIST
- M31 Receives ISO 26262 Development Process Certification and Enters Advanced Automotive Electronics Market
Breaking News
- Alphawave IP and Verisilicon Expand Partnership with $54M Multi-Year Exclusive Subscription Reseller Agreement for China Market
- BrainChip Inc. and NaNose Medical Successfully Detect COVID-19 in Exhaled Breath with Fast High-Accuracy Results
- TSMC Ranks in Top-10 For Capacity in Three Wafer Size Categories
- Palma Ceia SemiDesign Announces Nicky Wilkinson as Director IC Engineering
- Rambus and AMD Extend Patent License Agreement
Most Popular
- TSMC Ranks in Top-10 For Capacity in Three Wafer Size Categories
- CEVA's MotionEngine Smart TV Software Comes to More Smart TV brands via LG webOS
- North American Semiconductor Equipment Industry Posts January 2021 Billings, Topping $3 Billion for First Time
- Andes Technology and Rambus Collaborate to offer Secure Solution for MCU and IoT Applications
- SiPearl and Open-Silicon Research Collaborate to Accelerate Custom Silicon for High Performance Computing (HPC) Applications
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |