Ultra-low power 32 kHz RC oscillator designed in GlobalFoundries 22FDX
Zeevo, Inc., a Fabless Semiconductor and Communications Start-Up, Licenses ARM® Technology for Wireless Products
Zeevo, Inc., a Fabless Semiconductor and Communications Start-Up, Licenses ARM® Technology for Wireless Products
ARM Licenses Microprocessor Core to Emerging Leader in Semiconductor System-on-Chip Solutions for Wireless Personal Area Networking (WPAN) Solutions
SANTA CLARA, Calif., Dec. 6 - Zeevo, Inc. (formerly known as TelenComm, Inc), a provider of semiconductor "system on a chip'' (SoC) solutions for the communications market, today announced that it has licensed the ARM7TDMI® microprocessor core from ARM, for use in its single-chip Bluetooth[tm] Wireless Personal Area Networking (WPAN) solutions.
"The proven track record of the industry leader, ARM, its development tools, and its efficient and scaleable microprocessor architecture, is very important to us,'' said Greg Ravenscroft, VP of Marketing for Zeevo, Inc. "By utilizing the ARM7TDMI core, we can develop a very low-cost, high-value product that meets our functionality needs and also offers additional bandwidth to our customers to utilize for their applications.''
This agreement will enable Zeevo to produce one of the highest performance, lowest-power, and lowest-cost, single-chip solutions that addresses the needs of equipment manufacturers focused on adding Bluetooth WPAN functionality into their systems.
Ravenscroft adds, "Our chip will gain prominence for its high-performance features, small die size, low power consumption, excellent code density, and total integration. The core we selected needed to facilitate these aspects. We also needed an architecture that is well supported by semiconductor and system manufacturers, real-time operating system providers, third-party developers, and application software providers. ARM has an industry leading development and tools environment and is well supported by third party developers. ARM met our criteria, and that benefits our customers.''
"From the beginning, ARM has been a strong proponent of Bluetooth technology,'' said Reynette Au, VP, Marketing, ARM. "We are very supportive of companies like Zeevo that are driven to further advance the adoption of Bluetooth by creating high value-added innovations that encourage its use.''
Anil Aggarwal, CEO of Zeevo, Inc. summarized by saying, "This agreement reflects our company's commitment to align with industry leaders in key segments of our business. By combining Zeevo's innovative intellectual property with the ARM core, we will offer leading edge wireless Bluetooth connectivity solutions. The industry leading ARM core will allow our customers to adopt our solution with relative ease.''
About Zeevo
Zeevo, Inc. (formerly known as Telencomm, Inc.) is a privately owned fabless semiconductor company based in Santa Clara, CA. The company was founded in 1999 to develop and market "system on a chip'' (SOC) solutions for the communications marketplace. Zeevo's goal, Enabling Pervasive Connectivity[tm], means staying connected anytime, anywhere. For more information, see our web site at www.telencomm.com.
About ARM
ARM is the industry's leading provider of 16/32-bit embedded RISC microprocessor solutions. The company licenses its high-performance, low-cost, power-efficient RISC processors, peripherals, and system-chip designs to leading international electronics companies. ARM also provides comprehensive support required in developing a complete system. ARM's microprocessor cores are rapidly becoming the volume RISC standard in such markets as portable communications, hand-held computing, multimedia digital consumer and embedded solutions. More information on ARM is available at www.arm.com.
NOTE: ARM and ARM7TDMI are registered trademarks of ARM Limited. "ARM'' is used to represent ARM Holdings plc (LSE: ARM and (Nasdaq: ARMHY - news)); its operating company ARM Limited; and the regional subsidiaries ARM, INC.; ARM KK; ARM Korea Ltd. Bluetooth[tm] is the registered trademark owned by Telefonaktiebolaget LM Ericsson, Sweden.
Related News
- Howard Bubb Named CEO of Ambric, a Fabless Semiconductor Start-up
- Ambric, Inc. Adds Industry Veterans to its Start-up Team; New Fabless Semiconductor Company Adds VP of Architecture and Director of IP
- New Semiconductor IP Start-up Previews Silicon-Based Acceleration Technology for Wireless Internet Applications
- Start-up to offer integrated multimode RF for wireless
- Reconfigurable semiconductor IP start-up raises $14 million - backed by 3i, Actel, HP
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |