Structured ASIC Market Entering Boom Times
SCOTTSDALE, Ariz., May 13, 2005 - Worldwide merchant market dollar shipments of structured ASIC products are forecast to soar from the $209.8 million reached last year to $2.53 billion by 2009, reports In-Stat (http://www.in-stat.com). While the use of this technology will be dominated by ASIC designs throughout the forecast period, it will find growing applications in the world of Application-Specific Standard Products (ASSPs), whose revenues will reach nearly 30% of the market’s total by 2009. Communications, as is the case for most products of this type, will dominate the consumption of structured ASIC products, with the majority of applications being in the networking infrastructure, telecom, and cellular basestation segments.
A recent report by the high-tech market research firm found the following:
-
The Americas, followed by Japan, will dominate product consumption, accounting for more than 80% of all product dollar consumption over the forecast period.
-
Of the three major structured ASIC configuration categories, i.e., embedded array (embedded in a cell-based design), embedded FPGA (also embedded in a cell-based design) and reconfigurable CPU, the embedded array (or eArray) segment will dominate dollar shipments, albeit continually losing ground to the other methodologies.
-
The second largest end-use category for structured ASICs will be industrial, with the largest applications being in the medical, factory automation and instrumentation arenas.
The report, Structured ASICs: Designing For The Future (#IN0501919DE), includes an updated and in-depth analysis of the structured ASIC market. The report examines the major configuration options, including array-based, FPGA-based, configuration platform, and several others. Also examined is the relationship between the six major end-use market categories, as well as by second-level applications for the worldwide market, and for each region. The report also looks at the use of this technology for design of ASSPs, the various player offerings, major supplier rankings, and provides brief vendor profiles.
Market Research from In-Stat
In-Stat offers a broad range of information resources and analytical assets to technology vendors, service providers, technology professionals, and market specialists worldwide. The company stands alone in its ability to integrate both supply-side and demand-side research methodologies into a single comprehensive view of technology markets and products. This capability relies on a unique ability to cover the entire value chain from engineering-level technology, through equipment, infrastructure, services and end-users.
In-Stat is a part Reed Business Information, a leading provider of critical information and marketing solutions to business professionals and a member of the Reed Elsevier.
|
Related News
- Semico: Opportunities Abound in the Structured ASIC Market
- ChipX to Bring ARC's Configurable Cores to the Structured ASIC Market
- Faraday Offers Peripheral Composer, the Fastest Time-to-Market Structured ASIC for Peripheral Interface Chips
- ChipX and EE Solutions Team Up in Asia - Companies Leverage EE Design Expertise and ChipX Technology to Serve Structured ASIC Market Demand in Taiwan and China
- Structured ASIC market to grow 55%, says Semico
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |