- With optimal power/performance balance, the LSI403WLP is a perfect fit for SyChip's Voice over Wireless LAN solution
- Local ZSP solutions engineers speed processor integration and application software development
MILPITAS, Calif., May 23 /PRNewswire-FirstCall/ -- The ZSP Product Division of LSI Logic Corporation (NYSE: LSI) today announced that SyChip, the leader in radio frequency chip scale modules/system in package modules, has selected the LSI403WLP Z.Voice(TM) processor for use in its wireless VoIP connectivity module for next-generation dual-mode mobile phones.
The LSI403WLP is a Wafer Level Package (WLP) version of the award-winning LSI403LC voice processor. The WLP format allows the die to be mounted directly on a multi-chip module or printed circuit board with the same reliability and performance characteristics as packaged ICs.
"The optimized combination of power and performance available from the LSI403WLP made it an ideal component for our Voice over Wireless LAN module," said Moses Asom, co-founder and senior vice president of SyChip. "The level of support we've received from the DSP Solutions Engineering team has made integration of the processor a seamless part of our application development."
"Consumers are demanding lower-cost mobile communications, and Voice-over- WiFi will lead the way," said Ramesh Bhimarao, product line manager, LSI Logic. "Our Z.Voice VoIP processors and software bundles empower customers, like SyChip, to create innovative, cost-sensitive, low-power mobile devices that differentiate them in the marketplace and meet customer demand."
The LSI403WLP offers power control modes of idle, sleep, halt and PLL Bypass with the low energy consumption of 0.33mW/MHz during active mode for longer battery life in end products. The bumped die wafer level packaging allows for simplified integration and easy assembly, enabling customers to quickly design optimized solutions with further cost reduction. With its small form factor and extensive array of supporting low-energy and cost-effective Z.Voice technology and products, the LSI403WLP is expected to drive the market for integration of Voice-over-WiFi in mobile phones. The LSI403WLP is immediately available and is priced at less than $3 in quantities of 500K.
About the LSI Logic ZSP Processing Solutions
The ZSP Products Division of LSI Logic is a leading licensor of signal processing cores and solutions. The ZSP processor architecture enables customer innovation worldwide as the DSP of choice in many key vertical markets including 3G wireless handsets, multimedia and networked voice appliances. The ZSP roadmap offers a range of software compatible cores delivering performance points that meet the cost, power and efficiency constraints of today's SoC designs. A number of standard products are also available for lower volume designs and prototype implementations. ZSP Solution Partners augment the technology with world-class software tools, EDA modeling support and a large portfolio of application software.
About LSI Logic Corporation
LSI Logic Corporation focuses on the design and production of high- performance semiconductors for Consumer, Communications and Storage applications that access, interconnect and store data, voice and video. LSI Logic engineers incorporate reusable, industry-standard intellectual property building blocks that serve as the heart of leading-edge systems. LSI Logic serves its global OEM, channel and distribution customers with standard-cell ASICs, Platform ASICs and standard products, host bus adapters, RAID controllers and software. In addition, the company supplies storage network solutions for the enterprise. LSI Logic is headquartered at 1621 Barber Lane, Milpitas, CA 95035. http://www.lsilogic.com .