Scalable UHD JPEG Encoder − Ultra-High Throughput, 8/10/12-bit per component and CBR video encoding
Motorola readies ColdFire MPU for low-cost applications
![]() |
Motorola readies ColdFire MPU for low-cost applications
By David Lammers, EE Times
December 4, 2000 (7:21 p.m. EST)
URL: http://www.eetimes.com/story/OEG20001204S0041
AUSTIN, Tex. ( ChipWire) -- Motorola Inc.'s Semiconductor Products Sector has created a ColdFire-based standard device aimed at markets needing Ethernet or Universal Serial Bus connectivity at low cost. Manufactured in a mature 0.35-micron process technology, the MCF5272 standard part uses a ColdFire V2 processor core, just as Motorola is readying its latest V4 ColdFire core for more advanced process technology. The device's main components include a licensed USB 1.1 core from Phoenix Technologies, along with a 10/100 Ethernet core, said Wendell Smith, a marketing manager at Motorola's ColdFire/68k division. The chip follows a trend toward extremely high levels of integration, with four time-division multiplexer ports that support the 2B+D channels in the ISDN terminals popular in Europe and Japan, as well as analog connectivity, said Mireille Mazzaschi, ColdFire product marketing ma nager. Other standard peripherals include two UARTs, four 16-bit timers and dedicated memory controllers. Migration path "This presents an easy migration path for customers currently using the 68302 family," Mazzaschi said. Since Ethernet is "almost everywhere," he said, the device is being aimed at networking as well as industrial applications. The ColdFire V2 core delivers 63 Dhrystone 2.1 Mips at 66 MHz, and the die is packaged in a 196-pin plastic ball grid array. Motorola will begin general sampling of the device early next year, with production set for the second quarter. In quantities of 10,000, the V2 will be priced at $11.95.
Related News
- Altera Ships Arria GX Development Kit for Low-Cost FPGA Transceiver-Based Designs
- TTP Controller IP in Altera's Low-Cost Cyclone FPGA Families for Aerospace Applications
- Broad Range of Low-Cost, Third-Party Starter Kits for STM32 Microcontroller Available from STMicroelectronics
- CEVA Selected for NXP's Ultra Low-Cost Cellular Solutions
- Texas Instruments Launches New Low-Cost DaVinci(TM) Processor to Spur Growth of Portable, HD Video Applications
Breaking News
- Sondrel appoints Gareth Jones as VP ASIC
- Accenture Completes Acquisition of XtremeEDA to Expand Silicon Design Capabilities in Canada and US
- Xiphera's first financing round successfully completed
- Breker Verification Systems Joins RISC-V International as a Strategic Member to Drive Cache Coherency and SoC Integration Verification Methodologies
- 2022 a Focus for 12-inch Capacity Expansion, 20% Annual Growth Expected in Mature Process Capacity, Says TrendForce
Most Popular
- Weebit Nano tapes out ReRAM demo chip to SkyWater foundry
- Intel Foundry Services Forms Alliance to Enable Design in the Cloud
- Samsung Begins Chip Production Using 3nm Process Technology With GAA Architecture
- Synopsys and Arm Strengthen Partnership to Advance Next-Gen Mobile SoCs for Arm's Total Compute Solutions
- SiFive Expands Global Operations, Opens UK R&D Center in Cambridge
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |