NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
Taiwan plans SoC initiative
![]() |
Taiwan plans SoC initiative
By Mike Pan, EE Times
January 8, 2002 (4:15 p.m. EST)
URL: http://www.eetimes.com/story/OEG20020108S0065
TAIWAN, Taipei Taiwan's Industrial Development Bureau plans to launch a system-on-chip design initiative at the Nankang software park on the outskirts of the Taipei, the government said. Along with the SoC initiative, industry groups here said they also intend to form an IC design alliance this year. That alliance will include a design company that will oversee cooperation with companies in mainland China manufacturing CD players, DVD players and telecommunications gear. "Currently Taiwan is the second largest IC design center next to the U.S., but we need to upgrade to a more integrated, value-added orientation," said Hwang Tai-yang, director of the Office of the Committee for Information Industry Development, a part of Taiwan's Ministry of Economic Affairs. "Taiwan is moving beyond manufacturing operations and fulfilling OEM orders to building up independent IC designing capabilities to ride the major trend of developing SoCs for Int ernet and consumer-related products." Despite a global downturn in the semiconductor industry, the production value of Taiwan's IC design industry was expected to reach $3.41 billion in 2001, up from $3.29 billion in 2000, according to the Industrial Technology Information Service. The service also predicted that revenues from 2002 production are expected to reach $4.23 billion, a 24 percent increase. SoC developments of leading design houses would contribute to the increase, it said. Mike Pan is bureau chief for sister publication EE Times-Taiwan.
Related News
- Taiwan targets IC design as next expansion phase, plans SoC R&D park
- Faraday Announces Plans to Develop Arm-based 64-core SoC on Intel 18A Technology
- Toshiba Plans Deployment of Synopsys TetraMAX II on Upcoming SoC Design
- ARM Extends Solutions for Custom SoC development in Embedded and IoT Markets
- TSMC Plans to Invest $16 Billion More in Taiwan Site
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |