The design-service challenge: Q&A with Global Unichip
The global semiconductor industry is now seeing close cooperation between outsourced design and foundry. In Taiwan, the two leading design-service houses are usually identified as Global Unichip Corp., which enjoys a close relationship with foundry Taiwan Semiconductor Manufacturing Corp. (TSMC), and Faraday Technology Corporation, associated with foundry United Microelectronics Corporation (UMC).
DigiTimes.com recently had an opportunity to talk with Jim Lai, president and COO of Global Unichip, about the design-service business model, the company’s relationship with TSMC and the challenges involved with advanced technology design, including design for deep-submicron.
Click here to read more...
Related News
- Global Unichip Announces First Full Service SiP Production Flow in the Fabless ASIC Industry
- Synopsys DesignWare IP Enables Full-Service SoC Design Foundry for Global UniChip
- Global UniChip became TSMC MPW Service Partner Providing 0.25 um Logic Process MPW Service for worldwide customers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Global Unichip Corporation Deploys Cadence Clarity 3D Solver to Achieve 5X Speedup of Systems Analysis for 112G Long-Reach Network Switch
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |