Heard on the Beat: AMD-ST to merge memory units?
![]() | |
EE Times: Heard on the Beat: AMD-ST to merge memory units? | |
(06/06/2005 10:11 AM EDT) URL: http://www.eetimes.com/showArticle.jhtml?articleID=164300540 | |
The "buzz" among financial analysts is that Advanced Micro Devices Inc. and STMicroelectronics Inc. could possibly combine their respective and trouble memory operations in a mega venture. One analyst said that "it is possible" that AMD and ST would reportedly combine their memory operations even though there is no word if the two companies are actually talking. Another analyst said that it makes no sense that AMD and ST would combine their operations, given the problems with their respective units. In April, Spansion LLC, the flash memory venture of AMD and Fujitsu, filed for an IPO, likely indicating AMD is jettisoning its unprofitable memory unit. With the flash memory market plagued by a capacity glut and falling prices, memory suppliers have undergone rough sledding in recent months, Spansion being no exception. Analysts have called for AMD to focus on its growing microprocessor business by withdrawing its stake in the venture. AMD owns 60 percent of Spansion (see April 13 story).
At the same time, STMicroelectronics NV is considering selling its memory business, according to reports (see May 24 story). A newsletter from Semico Research Corp. refers to the Wall Street Journal stating that ST is considering selling its memory business. The newsletter goes on to observe that with Intel taking flash memory market share from ST in set-top boxes and the overall NOR market going into decline, the memory group at ST appears a reasonable target for a cut.
| |
- - | |
Related News
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |