NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
Philips takes $9M stake in Improv Systems
![]() |
Philips takes $9M stake in Improv Systems
By Peter Clarke, EE Times
November 22, 2000 (4:59 a.m. EST)
URL: http://www.eetimes.com/story/OEG20001121S0087
MUNICH, Germany Royal Philips Electronics BV has bought a minority stake in Improv Systems Inc., a provider of configurable hardware and software design platforms for voice-over-IP, networking and emerging media applications. According to a source close to the deal, Philips (Amsterdam, Netherlands) has made an investment of $9 million, although what proportion of Improv (Beverly, Mass.) equity the investment has secured has not been disclosed. Philips Semiconductors and STMicroelectronics, two European chip giants that have done much to pioneer system-on-chip (SoC) and platform-based design methods, are both licensees of Improv's technology. According to Improv, Philips made its investment for both the financial opportunity and to provide its semiconductor division with a closer relationship with the company, which has announced the commercial availabilit y of its Jazz PSA (Programmable System Architecture) platform. "The semiconductors division of Philips has been impressed with the Improv scalable architecture and its software development environment," commented Theo Claasen, chief technology officer of Philips Semiconductors. "It complements our existing range of advanced processing components to give us a broader spectrum of embedded systems technologies. Combined with our processor choices such as Trimedia, MIPS and ARM, we believe we have the broadest range of industry standard components to underpin our Nexperia platform concept." Cary Ussery, Improv's president, said, "By offering a configurable DSP core with specific focus on the voice-over-IP market, Improv is well-suited to enable Philips to achieve its long-term vision for the future of SoC design." He added, "An investment like this, from one of the world's largest semiconductor suppliers, demonstrates that the market is ready for configurable processors and the move to platform-based des ign."
Related News
- Mythic Launches AI Platform and Announces $9M Funding Round to Enable Datacenter-Scale Local AI in the Smallest Form Factor on Any Device
- Movidius Secures $9M Series C Funding
- Philips sells entire NXP equity stake to UK pension fund
- Silicon Hive spins out from Philips; New Venture Partners leads $10 million investment round, joined by TVM Capital and Philips
- Leading U.S-Based Semiconductor Company Takes $11M Multiyear License for ARC International's Patented Configurable Solutions
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |