Silicon & Software Systems (S3) Delivers Another First Time Right System IC Design

Dublin, Ireland, 9th June 2005 – Silicon & Software Systems Ltd (S3), a leading provider of outsourced System IC design services, today announced that its latest deep sub-micron system IC design demonstrated comprehensive functionality within hours of the first samples arriving from the foundry.

The chip, in development for the past 12 months with a team of up to twenty S3 engineers, includes a complex DRAM arbitration system, a microprocessor, embedded memories, connectivity peripherals and proprietary customer application-specific functional modules.

S3 contributed to the project in the areas of chip architecture and specification, as well as ASIC and IP vendor selection (this included sourcing various third party cores such as the microprocessor core and USB 2.0 Host and Device cores). S3 also supplied RTL coding, integration and verification of over twenty (20) blocks including an embedded USB 2.0 PHY, floor planning, synthesis, static timing analysis (STA), package selection, power analysis and other chip level features. A customized FPGA based emulation system was developed in parallel for software development and chip verification.

Commenting on the achievement, Dermot Barry, General Manager of the System IC Business Unit at S3, said "We are delighted to have accelerated another customer to market through the solid implementation of this complex design by S3. This phenomenal success demonstrates in very clear terms the value of S3's proven design and verification methodology for complex sub-system and full chips."

Given the nature of the design and S3's commitment to customer confidentiality, the application and customer details will not be announced at this time.

About Silicon & Software Systems Ltd. (S3):

Silicon & Software Systems (S3) has a 19 year track record of providing innovative System IC design solutions right first time based on a unique combination of Design Expertise, Proprietary IP and Advanced Methodologies. S3 focuses on leading edge IC design and has already completed many designs in 90 nm targeting various foundries. S3 works with the world's top semiconductor companies (IDMs and fabless) and has working relationships with leading foundries such as IBM, TSMC and UMC. S3 also provides a specialized portfolio of Mixed Signal IP featuring blocks such as ADCs, DACs, PLLs and LVDS transmitter for a variety of technically demanding applications such as Wireless LAN, Broadband Communications, Imaging and Video. S3 Web Site: www.s3group.com

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