CEVA-Audio™ - an Integrated Hardware and Software DSP-based Solution - Delivers a Low-Power, Low-Cost Platform with Easy Design Integration
SAN JOSE, Calif. - June 27, 2005 - CEVA, Inc. (NASDAQ: CEVA; LSE: CVA) the leading licensor of digital signal processor (DSP) cores, multimedia, GPS and storage platforms to the semiconductor industry, today unveiled CEVA-Audio™ - a new DSP-based audio platform targeting high-volume markets such as portable audio players, cellular handsets and home entertainment equipment. CEVA-Audio is a low-power, low-cost platform that combines several CEVA-developed technologies including CEVA-TeakLite-II™, the new and enhanced version of the widely-adopted CEVA-TeakLite™ DSP core, a cache memory subsystem, audio peripherals, a comprehensive set of audio codecs and complete tool chain support.
"The CEVA-Audio solution is based on industry-recognized technology, with the CEVA-TeakLite-II DSP core having a family heritage of deployment in more than 500 million units," said Will Strauss, founder and president, Forward Concepts. "Moreover, CEVA's audio codecs have already been deployed by leading chip manufacturers for cellular and consumer electronics devices. CEVA-Audio offers simple integration, designed to dramatically decrease time to market while the "one-stop-shop" approach reduces complexity and customers' risk."
CEVA-Audio, a fully synthesizable soft IP, operating at up to 200MHz, is built on a small DSP core and cache memory subsystem, with overall die size of less than two square mm, and 0.1 mA/Mhz for stereo MP3 decoder (using TSMC 0.13u G process). It supports all of the industry standard audio and speech codecs, including MP3, WMA, AAC, HE-AAC, Ogg Vorbis, BSAC, NB-AMR and WB-AMR.
"Today's consumers are demanding more functionality and longer battery life for less money," said Gideon Wertheizer, CEO of CEVA, Inc. "Built by CEVA in-house, CEVA-Audio underscores our commitment to provide the industry with complete platform solutions built around our DSPs, offering our customers cost, power and time to market benefits."
The CEVA-Audio DSP subsystem includes peripherals, which bridges the gap between a stand alone DSP and a complete audio platform, and includes a three-channel DMA to reduce the data transfer overhead. CEVA-Audio is designed for the low cost, power efficiency and performance required for portable applications, and includes a power management unit to further reduce power consumption. The low-cost solution is further achieved by using a cache memory subsystem. The host interface is a standard AMBA 2.0 interface, including a high-speed master AHB bus for high volume data traffic and an APB port for host control. The CEVA-Audio is a configurable IP allowing the user to control the die size and performance. The configurations include an optional TDM module, optional tightly-coupled memory and configurable memory size. A complete development tool chain is provided including a C/C++ compiler, profiler, simulator, debugger and system boards.
CEVA-Audio is further enhanced by the vast CEVAnet partner program, whereby partners provide additional audio elements to enhance the CEVA-Audio-based products. .More information on CEVA and its products can be found at www.ceva-dsp.com.
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