Triscend adopts Sequence interconnect modeling for configurable System-on-Chip Design
Columbus[tm] 3-D RLC extraction tools chosen for accuracy, ease of use
SANTA CLARA, CALIF. - November 13, 2000 - Sequence Design Inc., the specialist in power and timing closure solutions for system-on-chip design, today announced Triscend Corporation will deploy the company's Columbus[tm] RLC Interconnect Modeler for the design of advanced CMOS integrated circuits.
Triscend plans to deploy Sequence's Columbus interconnect modeling tool in the development of very deep sub-micron Configurable System-on-Chip (CSoC) devices. The tool will be integrated into Triscend's full-custom design environment, which supports leading-edge silicon processes. "Triscend was the first to introduce a Configurable System-on-Chip device, and we soon followed that with the industry's first 32-bit CSoC device. Our ability to quickly develop new products is enhanced by state-of-the-art tools like Columbus," said Danesh Tavana, vice president of engineering and co-founder at Triscend. "We chose the Columbus tool based on its reputation for accuracy and its ease of use. Its overall value helps us achieve faster time-to-market so that we can more quickly meet our customers' needs."
"Triscend's innovative approach to system-on-chip design changes the dynamics of bringing complex communications products to market quickly," said Eric Filseth, vice president, product marketing for Sequence. "We are very pleased to announce this relationship."
Columbus is a state-of-the-art interconnect modeling tool used during the physical design of deep-submicron and nanometer integrated circuits. At silicon geometries of 180 nanometers and below, a chip's performance is dramatically affected by the parasitic resistance, capacitance and inductance of its interconnect. Columbus' patented Exact Topological Decomposition algorithm not only enables it to achieve the industry's highest modeling accuracy, but also scales efficiently in multiprocessing environments such as compute farms; this makes Columbus an ideal choice for very large "system-on-chip" designs.
Furthermore, Columbus integrates into RF, analog, full-custom digital, and standard-cell design flows, enabling it to model the interconnect of designs containing many kinds of circuitry within the same chip.
Columbus leverages technology libraries based on the Silicon Integration Initiative (Si2) SIPP standard, an industry format supported by leading foundries such as TSMC, UMC, Chartered Semiconductor and others.
Triscend Corporation is the leading provider of Configurable System-on-Chip (CSoC) devices - a single-chip combination of a dedicated industry-standard microprocessor, embedded programmable logic, a dedicated system bus, and memory. Targeted at the communications market, Triscend CSoC devices, along with the FastChip Software Development System, fill the gap between fully custom system-on-chips and application specific standard products, providing the next level of integration, time-to-market and programmability. Founded in 1997, Triscend is privately held and venture capital funded and is headquartered in Mountain View, Calif. More information on Triscend is available at www.triscend.com or by calling (650) 968-8668.
Sequence Design Inc. is the specialist in timing and power optimization for design closure in system-on-chip integrated circuits. Sequence's chip design software and services enable engineering teams to develop superior products quickly, in order to achieve competitive advantage in high-growth technology markets. Customers include Broadcom, Ericsson, Fujitsu, LSI Logic, NEC, Nokia, Nortel Networks, MMC Networks, Sony, Sun Microsystems, Texas Instruments, Toshiba and Vitesse Semiconductor.
Sequence supports worldwide development and field service operations. The company was formed through the merger of Sente, Inc and Frequency Technology. Sequence is privately held; investors include IVP, Menlo Ventures, Alpine Technology Ventures, Atlas Venture, Intel, Sumitomo Corporation, LSI Logic, Sofinnova, Skywood Ventures and Sigma Partners. Sequence is a member of Cadence Design Systems' (NYSE: CDN) ConnectionsTM and Mentor Graphics' (NASDAQ: MENT) Open Door[tm] partnership programs. Please visit our web site at www.sequencedesign.com.
FOR MORE INFORMATION:
Eric Filseth, Sequence Design Inc.
(408) 961-2365, email@example.com
Ann Steffora, VitalCom Marketing & Public Relations
(650) 637-8212, x207, firstname.lastname@example.org
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