TTPCom demonstrates its multiplatform credentials with Intel on the O2 XM handset
Ian Clarke, Head of Devices at O2 comments: "We are delighted to launch the O2 XM – our high quality music phone – which takes full advantage of the powerful combination of TTPCom’s industry-leading protocol stack and Intel’s high performance processor technology. We have previously launched many O2 products that use the TTPCom protocol stack – this latest implementation in the O2 XM is the proof that TTPCom’s multi-platform strategy is now a reality.”
Richard Walker, director of TTPCom's software business unit adds: "We strongly believe in delivering choice and efficiency to the industry. This latest handset shipment demonstrates that our warranted software is now also proven on Intel chipsets. Our philosophy, to offer the same proven protocol software across multiple platforms, enables operators to reduce the burden of interoperability testing whilst maintaining diversity of supply.”
About TTPCom and Intel
The TTPCom and Intel collaboration was established to offer choice for handset developers in an increasingly segmented market. The relationship involves a combined roadmap and has resulted in the creation of a joint office, based near TTPCom’s Cambridgeshire headquarters. This facility is staffed by a combination of TTPCom and Intel experts to offer a single point of contact for complete system support for all 2G and 3G customers.
About TTPCom
With 10 offices and development centres around the world, TTPCom Ltd (www.ttpcom.com) is the principal operating subsidiary of TTP Communications plc (LSE: TTC). The company is the leading independent developer of intellectual property used in the design and manufacture of wireless communication devices. TTPCom licenses its technology to leading semiconductor and terminal manufacturers worldwide, including Analog Devices, Intel, LG, NEC, Renesas and Sharp.
TPCom has established a world leading position with its GPRS, EDGE and 3G protocol software; offers rapid customisation of handsets through its AJAR applications framework; and develops both radio and baseband cellular engines through its macro products. More than 40 million products using TTPCom technology were shipped during 2004.
|
Related News
- Synopsys Demonstrates Industry's First Interoperability of PCI Express 6.0 IP with Intel's PCIe 6.0 Test Chip
- Synopsys Demonstrates Industry's First PCI Express 5.0 IP Interoperability with Intel's Future Xeon Scalable Processor
- AI Semiconductor Company Syntiant Demonstrates Analog Neural Network for Always-on Battery-powered Devices, Closes A Round Funding Led by Intel Capital
- Intel Custom Foundry Demonstrates Industry-Leading 32 Gbps SerDes on 14nm Process
- ASMedia Technologies Demonstrates Industry's First SuperSpeed USB 10 Gbps (USB 3.1) Silicon ASM1352R (USB3.1 to SATA6G with RAID) at Intel Developer Forum
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
- Efinix Rolls Out Line of FPGAs to Accelerate and Adapt Automotive Designs and Applications
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024
E-mail This Article | Printer-Friendly Page |