- LSI Logic expands its Platform ASIC offering with extended temperature performance in 0.18-micron and 0.11-micron process technologies
- RapidChip Integrator(TM) and RapidChip Integrator2(TM) families now available in military and industrial specifications
- RapidChip Integrator(TM) and RapidChip Integrator2(TM) military range tested in compliance with Mil-Std 883B specifications using LSI Logic's proprietary Statistical Post-Processing(TM) at wafersort
MILPITAS, Calif., July 11 /PRNewswire-FirstCall/ -- LSI Logic (NYSE: LSI) today announced that it is now offering devices that meet the full temperature range operating performance required by a wide variety of military and industrial applications in its leading G12(R) 0.18-micron and Gflx(TM) 0.11- micron process technologies. With in-depth system expertise, LSI Logic is able to deliver proven, high quality Platform ASIC solutions, specifically the RapidChip Integrator and RapidChip Integrator2(TM) families, to designers in the military, avionics, space and medical sectors. This offering comes on the heels of LSI Logic receiving the industry's first Qualified Manufacturers List (QML) certification at 0.13-micron process technology for the U.S. Department of Defense and Armed Forces and its full support of Do254 logic -- further evidence of LSI Logic's commitment to military and industrial customers.
"By offering extended temperature ranges in a number of RapidChip slice families, LSI Logic hits another key milestone demonstrating its continued investment in the military and industrial markets," said John Bendekovic, director of military and aerospace marketing and business development for LSI Logic. "We are in these markets for the long-term and will continue to offer the highest quality, most reliable products for our customers, enabling them to integrate our RapidChip Platform ASIC slices into their designs. In addition to our process technology expertise, our systems and RapidChip slices offer customers the functionality and non-volatile benefits of a single-chip device -- low power, security and single-event effect tolerance."
Military and industrial applications are required to tolerate wider temperature ranges in order to operate reliably in more challenging environments as well as the ability to meet specific regulations and guidelines. Using LSI Logic's patented Statistical Post-Processing(TM) (SPP) at wafersort, the RapidChip Integrator family has been tested and fully complies with the Mil-Std 883B specifications, offering a temperature range of negative 55-degrees to 125-degrees Celsius. LSI Logic's RapidChip Integrator(TM) and RapidChip Integrator2(TM) families are now also available within the extended industrial-specific temperature range of negative 40- degrees to 110-degrees Celsius operating conditions to full databook performance.
Bendekovic added, "Moving forward, LSI Logic will continue to invest in new methods and tools that ensure our military and industrial customers' designs continue to comply with the most stringent requirements."
About LSI Logic Corporation
LSI Logic Corporation focuses on the design and production of high- performance semiconductors for Consumer, Communications and Storage applications that access, interconnect and store data, voice and video. LSI Logic engineers incorporate reusable, industry-standard intellectual property building blocks that serve as the heart of leading-edge systems. LSI Logic serves its global OEM, channel and distribution customers with standard-cell ASICs, Platform ASICs and standard products, host bus adapters, RAID controllers and software. In addition, the company supplies storage network solutions for the enterprise. LSI Logic is headquartered at 1621 Barber Lane, Milpitas, CA 95035. http://www.lsilogic.com.