English
Ultra-low power 32 kHz RC oscillator designed in GlobalFoundries 22FDX
IBM to offer CMOS image sensor foundry services
| | |
| EE Times: Latest News IBM to offer CMOS image sensor foundry services | |
| Spencer Chin (07/13/2005 10:18 AM EDT) URL: http://www.eetimes.com/showArticle.jhtml?articleID=165701930 | |
| MANHASSET, N.Y. — IBM Corp. has announced it would make available technology and manufacturing services for complementary metal oxide semiconductor (CMOS) image sensors for use in camera-phones, digital still cameras and other consumer products. IBM (Armonk N.Y.) announced a CMOS image sensor development and manufacturing collaboration with Kodak last September, which included the license of Kodak CMOS image sensor fabrication intellectual property to IBM. Kodak has announced new three- and five-megapixel CMOS image sensors qualified and manufactured for Kodak by IBM's semiconductor plant in Burlington, Vt., that utilize this process. IBM's foundry offering is based on IBM's 0.18-micron copper CMOS manufacturing process, available at its Burlington facility, that features an integrated design kit, including a four-transistor, 3-micron pixel with a pinned diode, and access to IBM's image sensor circuit library. According to IBM, the sensors' image quality can be improved through the company's ability to produce sensors with a 2.5-micron copper stack incorporating an on-chip color filter and microlens. The copper stack is approximately 30 percent thinner than standard aluminum-based processes, which IBM said can significantly improve light collection efficiency (quantum efficiency) for improved picture quality in low light.
| |
| All material on this site Copyright © 2005 CMP Media LLC. All rights reserved. Privacy Statement | Your California Privacy Rights | Terms of Service | |
Related News
- IBM announces new CMOS image sensor foundry offering
- Zhuhai Chuangfeixin: OTP IP Based on 90nm CMOS Image Sensor Process Technology Successfully Mass-Produced
- Andes Technology and MetaSilicon Collaborate to Build the World's First Automotive-Grade CMOS Image Sensor Product Using RISC-V IP SoC
- Mixel MIPI D-PHY IP Integrated into Teledyne e2v's new Topaz CMOS Image Sensors
- Cista Design Inc. Selects Kilopass OTP NVM for Next Generation CMOS Image Sensor on SMIC Independently Developed 130nm Back Side Illumination Technology Platform
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
|
E-mail This Article | 
|
|
Printer-Friendly Page |