Certification Ensures Lower Risk for Customers Integrating High-Speed USB into System-on-Chip Solutions
IRVINE, Calif.--July 20, 2005--TransDimension, a leading provider of USB connectivity solutions for embedded applications, today announced the successful completion of the industry's first USB Implementers Forum (USB-IF) High-speed On-The-Go (OTG) certification testing of a ULPI Controller.
Certification testing was completed on TransDimension's high-speed USB OTG controller IP and the SMSC USB3300 stand-alone transceiver. The successful completion of the certification testing assures a low-risk implementation and faster time to market for customers that are integrating high-speed USB into their system-on-chip (SoC) solutions.
TransDimension's high-speed USB OTG controller IP with a UTMI+ Low Pin Interface (ULPI) block and SMSC's USB3300 ULPI stand-alone physical layer transceiver (PHY), are the first high-speed USB products with the ULPI interface to pass this compliance testing.
According to Pete Todd, vice president of sales at TransDimension: "Being the first ULPI-enabled solution to pass high-speed host and OTG compliance testing by the USB-IF has validated the hard work of our world-class development team. Our solution was the first high-speed USB OTG IP core on the market and now it is the first ULPI solution to achieve the high-speed certification. This unmatched maturity and performance allows our IP core to remain clearly differentiated in a competitive market. With the ULPI interface, ASIC, SoC and FPGA designers can now leverage an off-the-shelf high-speed USB solution to accelerate their product's time to market without compromising on pin count or cost."
The ULPI interface is a modification to the well-known UTMI+ link/PHY interface and significantly reduces the pin count necessary for discrete USB transceiver implementations to support host, device or OTG functionality. This low pin count interface allows transceivers to be kept separate from the associated digital ASICs as the technology nodes become smaller and integrating the PHY becomes more complex and expensive.
Todd added: "Working with SMSC has been mutually beneficial as it has allowed both parties to conduct rigorous interoperability testing between our high-speed OTG IP and SMSC's USB3300 PHY. This translates to production readiness for the benefit of our mutual customers. Achieving compliance with the new high-speed OTG test procedure, in addition to the previously announced high-speed peripheral and full-speed OTG certification, means TransDimension and SMSC have successfully turned the 'triple play' of high-speed USB compliance testing."
TransDimension and SMSC were the first companies to achieve successful completion of the USB-IF OTG compliance testing in December 2004. The companies also achieved the first USB-IF certification of a ULPI controller and transceiver in November 2004. High-speed OTG compliance testing is governed by the USB-IF.
With headquarters in Irvine, TransDimension is a privately held company founded in 1997 to develop and market connectivity solutions. TransDimension's product lines include the integrated circuits, IP cores and USB software stacks that enable wired and wireless connectivity between a wide range of PC peripheral, consumer electronic and mobile device applications. TransDimension's SoftConnex USB solutions provide the broadest operating system and CPU platform support and the largest library of peripheral class drivers available. More information about TransDimension can be found at http://www.transdimension.com.