Complete I/O library and controller solution for data rates up to 800Mb/s/pin
SUNNYVALE, California and OTTAWA, Canada - August 10, 2005 - MOSAID Technologies Incorporated (TSX:MSD), today announced with UMC (NYSE: UMC; TSE: 2303), a world leading semiconductor foundry, that the two companies are cooperating on the development of comprehensive Double Data Rate (DDR)/DDR2 SDRAM memory controller Semiconductor Intellectual Property (IP) solutions for UMC's 90nm and 130nm process geometries.
The comprehensive MOSAID memory controller solution, for UMC's advanced processes, is being built with high performance SSTL I/O library and Delay Locked Loop (DLL) hardened IP elements as well as the controller RTL soft IP. The solution supports both the DDR SDRAM standard with SSTL2 signaling and DDR2 SDRAM with SSTL18 signaling. It is also being designed so customers' products can interface to either DDR SDRAM or DDR2 SDRAM, without requiring two separately manufactured versions of the product. The MOSAID memory controller IP will be delivered as a library of easily connected elements rather than a single, hardened block. This will allow customers the flexibility to create a variety of different memory interface and bond pad configurations. The controller is intended to support chip-to-chip and chip-to-module configurations with speeds up to 800Mb/s/pin.
Ken Liou, director of the IP and Design Support division at UMC, said, "UMC recognizes the important role that DDR memory plays in today's semiconductor industry applications. MOSAID is a valuable IP provider of DDR solutions, and we are pleased to work with this company to port its memory controller IP to our nanometer technologies. MOSAID's DDR2 SDRAM memory controller will be a welcome addition to our other 0.13um and 90nm IP components available for implementation into customers' SoC designs."
"Our collaboration with UMC will make MOSAID's memory controller IP more widely available to customers targeting UMC's advanced 90nm and 130nm process technologies," said Peter Gillingham, vice president and general manager of MOSAID's Intellectual Property Division. "As the speed of standard DDR and DDR2 SDRAM memory devices increases, the benefits of MOSAID's and UMC's memory controller collaboration in reducing design effort and risk, and accelerating time-to-market become more compelling."
The DDR/DDR2 SDRAM memory controller will be licensed and supported directly by MOSAID as bundled components or individual components such as the application specific SSTL I/O library, DDR/DDR2 SDRAM PHY, or controller RTL. Upon silicon validation, UMC also intends to offer the IP through its IP catalog. The MOSAID DDR/DDR2 SDRAM memory controller IP is slated to be available starting in the Fall of 2005.
MOSAID Technologies Incorporated makes memory better through the development and licensing of intellectual property and the supply of memory test and analysis systems to semiconductor manufacturers, foundries and fabless semiconductor companies around the world.
Founded in 1975, MOSAID is based in Ottawa, Ontario, Canada, with offices in Santa Clara, California; Newcastle upon Tyne, U.K; and Tokyo, Japan. For more information, visit the Company's web site at www.mosaid.com.
UMC (NYSE: UMC, TSE: 2303) is a leading global semiconductor foundry that manufactures advanced process ICs for applications spanning every major sector of the semiconductor industry. UMC delivers cutting-edge foundry technologies that enable sophisticated system-on-chip (SOC) designs, including 90nm copper, 0.13um copper, and mixed signal/RFCMOS. UMC is also a leader in 300mm manufacturing; Fab 12A in Taiwan and Singapore-based Fab 12i are both in volume production for a variety of customer products. UMC employs approximately 10,500 people worldwide and has offices in Taiwan, Japan, Singapore, Europe, and the United States. UMC can be found on the web at www.umc.com.
Note From UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are forward looking within the meaning of the U.S. Federal Securities laws, including statements about future outsourcing, wafer capacity, technologies, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks.