FSA provides members with access to D&R catalog
EE Times: FSA provides members with access to D&R catalog | |
Peter Clarke (09/08/2005 7:13 AM EDT) URL: http://www.eetimes.com/showArticle.jhtml?articleID=170701355 | |
LONDON Design and Reuse (D&R) has agreed to provide members of the Fabless Semiconductor Association with access to its catalog of intellectual property (IP) cores. The terms of the agreement were not disclosed. D&R (Grenoble, France) added that it would explore collaboration with the FSA on other initiatives. The FSA, headquartered in Dallas, Texas and with offices in San Jose, California, has been increasing its activities in Europe over the last two years (see Aug. 8 story). “Intellectual property has been identified by our members as the top technology challenge for FSA to address,” said Jodi Shelton, co-founder and executive director of FSA, in a statement issued by D&R. “By facilitating this collaboration, we can provide this tool to our members to support sound business decisions and help to reduce barriers to using third-party IP.” “We have invested great time and effort to achieve our vision of providing the industry’s leading source of information on IP,” said, Gabriele Saucier, chairman of D&R, in the same statement. “FSA’s desire to offer this to their members acknowledges our vision and speaks to the quality service we provide.” Last month, D&R announced a similar partnership with China Software and Integrated Circuit Platform (CSIP). D&R is partly owned by CMP Media LLC, which also owns EE Times.
| |
- - | |
Related News
- D&R Provides Internet Gateway for Mentor Graphics Inventra IP Catalog
- AI Silicon IP Provider Expedera Opens R&D Office in Singapore
- M31 Opens Bangalore R&D Design Center in India Expands Recruitment of Global Talent
- SiFive Expands Global Operations, Opens UK R&D Center in Cambridge
- Industry R&D Spending To Rise 9% After Hitting Record in 2021
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
E-mail This Article | Printer-Friendly Page |