AUSTIN, Texas--Sept. 14, 2005
--The Silicon Integration Initiative (Si2) today officially announced the formation of the Open Modeling Coalition (OMC) to address critical issues -- such as accuracy, consistency, security, and process variations -- in the characterization and modeling of libraries and IP blocks used for the design of integrated circuits. The underlying problems and inconsistencies in current library representations were presented in an open industry meeting at the Design Automation Conference on June 15, 2005. As a result of that meeting and positive industry feedback, Si2 has decided to proceed with this important program. Si2 member companies participating in the OMC include: ARM, Cadence Design Systems, IBM, Intel, LSI Logic, Magma Design Automation, Philips Semiconductor, Renesas Technology Corp., Silicon Navigator, ST Microelectronics, Sun Microsystems, and Virage Logic. Other companies are invited to participate in this pioneering project.
The OMC technical objectives are to define a consistent modeling and characterization environment in support of both static and dynamic library representations for improved integration and adoption of advanced library features and capabilities, such as statistical timing. The system will support delay modeling for library cells, macro-blocks and IP blocks, and provide increased accuracy to silicon for 90nm and 65nm technologies, while being extensible to future technology nodes. Technology contributions from Cadence Design Systems, IBM, Magma Design Automation, Synopsys, and other companies are in support of these goals.
The initial OMC Working Groups (WG) are addressing the following proposed library standards:
ECSM Change Management: Supporting the static approach, this group is responsible for evolution of the Effective Current Source Model (ECSM) library format. Current source models permit more accurate modeling of long, complex interconnects. The ECSM cell driver represents non-linear switching waveforms using a current source, rather than voltage source, to model delay under conditions of varying voltages and dominant interconnect effects, necessary for ultra low-power and high speed designs. It calculates the non-linear impact of voltage drop on delay and also enables multiple voltage islands on the same substrate. The ECSM donation also forms a starting point for the drive for future convergence of the currently competing file formats.
Data Model Consistency: Supporting the dynamic approach, this group addresses the interface between the Open Modeling Coalition and the OpenAccess Coalition. The scope of work is to determine the design and timing information that must be stored within the hierarchical data model and the APIs associated with it. The API will be based on the current IEEE 1481 standard. This group must determine when queries are made which are vectored to the application and which are vectored to the data model. The goal is to provide an application a consistent set of APIs that all have the same look-and-feel.
Statistical Timing: This group is defining semantic extensions to the static representation, the APIs and information model needed to support one or more recommended means for statistical timing analysis. The deliverables of this WG include a paper specification and possibly a statistical timing interface header file to further industry-wide interoperability. This WG closely interacts with the Data Model Working Group to ensure a consistent extension of the API and information model.
Characterization Data: This group handles the technical definitions and concerns associated with providing all the required characterization information from the submitted characterization engines to the modeling engine. There are several choices here, including a direct API, a plug-in architecture (such as IEEE-1481), and/or file format transfer. In the process of doing its work, this group will consider the unique requirements, if any, of both the static and dynamic representations of delay models.
For more information on the OMC, visit: www.si2.org/?page=430
Si2 is an organization of industry-leading semiconductor, systems, EDA and manufacturing companies focused on improving the way integrated circuits are designed and manufactured in order to speed time-to-market, reduce costs, and meet the challenges of sub-micron design. Si2 is uniquely positioned to enable collaboration through a strong implementation focus driven by its member companies. Si2 focuses on developing practical technology solutions to industry challenges. Si2 represents over 85 companies involved in all parts of the silicon supply chain throughout the world.
All listed trademarks are the property of their respective owners.