Sonics SMART Interconnects(TM) Foundation of New Micro Topaz Advanced Computing Subsystem for SoCs

Topaz Offers Fast Customization Supporting Individual Customer Needs

SAN JOSE, Calif. and MOUNTAIN VIEW, Calif., Sept. 26, 2005 -- K-Micro, a leader in advanced yet affordable ASICs, and Sonics Inc.®, the premier supplier of system-on-chip (SoC) SMART Interconnects(TM), today announced that Sonics' SiliconBackplane(TM) III and Sonics3220(TM) SMART Interconnect(TM) technologies form the core of K-Micro's new Topaz computing subsystem for SoC design.

Announced today, Topaz allows customers to rapidly combine their proprietary designs with standard technology blocks from K-Micro's IP portfolio. Sonics SMART Interconnects provide the complex data flow services to manage IP blocks, such as microprocessors, DSPs, hardware accelerators or packet processors, with a high degree of silicon efficiency and high data throughput. As a result, the engineering effort to develop similar data flow services now required to complete SoC designs has been eliminated.

"Sonics' technology is an essential element enabling the key value provided by Topaz, namely fast customization," said Sunil Baliga, vice president of marketing and business development at K-Micro. "The SiliconBackplane III is used as the main interconnect in Topaz, with the Sonics3220 used to interconnect numerous Topaz peripherals, such as UART, Timer, and I2C. We plan to use Sonics technology, including Sonics MX(TM), as we roll out future versions of Topaz."

"Our participation with K-Micro brings together a comprehensive, field-proven SoC interconnect architecture with a proven design methodology," said Phil Casini, vice president of marketing at Sonics. "Customers can leverage this combination to build complex SoCs in a fraction of the time and for a fraction of the cost when compared to traditional design methodologies that are now outdated."

About K-Micro

K-Micro is a leader in advanced yet affordable ASIC technology. The company's innovative technologies and world-class design support are used in the consumer electronics, computer, office-automation, networking and storage markets. The company is an active participant in industry standards organizations, including the Wi-Fi Alliance, Optical Internetworking Forum (OIF), PCI Special Interest Group (PCI-SIG), USB Implementers Forum, MPEG Industry Forum (MPEGIF), Mobile Computing Promotion Consortium (MCPC), the Digital Display Working Group (DDWG), SD Card Association (SDA) and OCP International Partnership (OCP-IP). K-Micro has design centers in Boston, San Jose, Taipei, and Tokyo. For more information, contact the company at 408-570-0555, or visit http://www.k-micro.us .

About Sonics

Sonics, Inc. is a leading provider of SMART Interconnects that deliver high SoC design predictability and increased design efficiency. Major semiconductor and systems companies including Broadcom, Samsung, Texas Instruments and Toshiba have applied Sonics SMART Interconnects in leading products in the wireless, digital multimedia and communications markets. Sonics is a privately-held company funded by Investar Capital, Smart Technology Ventures, TL Ventures, Easton Hunt Capital, JAFCO Ventures, and H&Q Asia-Pacific. For more information, see www.sonicsinc.com.