Atheros Licenses Tensilica's Xtensa Processor Core
Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)
Santa Clara, Calif. – September 26, 2005 – Tensilica, Inc., today announced that Atheros Communications, Inc. (NASDAQ: ATHR), a leading provider of advanced wireless solutions, has licensed the Xtensa configurable and extensible processor core for future product designs.
"We selected Tensilica's Xtensa processor because of its high-performance, low power and small size which are ideal for a wide range of very compact wireless applications," said Rick Bahr, VP of Engineering for Atheros Communications. "Xtensa's configurable and extensible microprocessor core provides Atheros and our customers with a high level of design flexibility required to satisfy the growing array of end-product application requirements."
“We are excited to be working with an innovative company like Atheros,” stated Steve Roddy, Tensilica’s vice president of marketing. “This is another good example of the growing momentum for the Xtensa architecture.”
About Atheros
Atheros Communications is a leading developer of semiconductor system solutions for wireless communications products. Atheros combines its wireless systems expertise with high-performance radio frequency (RF), mixed signal and digital semiconductor design skills to provide highly integrated chipsets that are manufacturable on low-cost, standard complementary metal-oxide semiconductor (CMOS) processes. Atheros technology is being used by a broad base of leading customers, including personal computer, networking equipment and handset manufacturers. For more information visit www.atheros.com or send email to info@atheros.com.
About Tensilica
Tensilica was founded in July 1997 to address the growing need for optimized, application-specific microprocessor solutions in high-volume embedded applications. With a configurable and extensible microprocessor core called Xtensa, Tensilica is the only company that has automated and patented the time-consuming process of generating a customized microprocessor core along with a complete software development tool environment, producing new configurations in a matter of hours. For more information, visit www.tensilica.com.
|
Related News
- ClariPhy Licenses Tensilica's Xtensa Dataplane Processor (DPU) for Optical Networking Mixed Signal, Digital Signal Processing (MXSP) SOCs
- Chelsio Communications Licenses Tensilica's Xtensa LX Customizable Dataplane Processor Core for 10 Gigabit Ethernet
- HiSilicon, a Division of Huawei, Licenses Tensilica's Xtensa Dataplane Processor and ConnX DSP IP Cores
- WiLinx Licenses Tensilica's Xtensa LX2 Processor Core For Low-Power UWB Chips
- DS2 Licenses Tensilica's Xtensa Processor for 200 Mbps Powerline Chipset
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |