Jazz Semiconductor Delivers Next-Generation 0.13 Micron Process Platform Focused on Advanced Analog and RF Systems on Chip

Jazz Process Combines Perfect Balance of Cost and Performance with 0.13 Micron Front-End and Aluminum-Based Back-End

NEWPORT BEACH, Calif. & SAN JOSE, Calif.--Oct. 5, 2005-- Jazz Semiconductor, an independent semiconductor wafer foundry, today announced at the 2005 FSA Conference, the availability of process design kits for its 0.13 micron RFCMOS process, CA13, an innovative approach to enabling analog system on chip integration. The Jazz 0.13 micron process platform is a low-cost alternative for applications that do not require the expensive copper interconnect of traditional 0.13 micron CMOS implementations for the back-end and pairs low-power digital logic with high-performance analog and RF circuitry.

Jazz has focused on enabling the integration of key analog and RF functions by using an aluminum metal interconnect scheme to deliver the same RF performance and low power consumption of conventional 0.13 micron technology while maintaining the lower cost and reduced complexity of the familiar aluminum-based approach without requiring expensive copper (Cu) interconnect layers. The Jazz platform is further differentiated by the addition of a triple well for RF isolation, 5.6fF/um2 MIM capacitors, varactors, low and high value precision resistors, and thick metal inductors for improved RF and analog performance.

The CA13 platform reuses key modules from Jazz's 0.35um and 0.18um platforms, provides six layers of metal, and can include high-performance modules such as SiGe NPNs, Vertical PNPs, High-Voltage FETs and non-volatile memory. Designers can use the Jazz 0.13 micron process platform to integrate more high-density digital content with existing products in parallel with scaling the analog portion of the chip at 0.35um, 0.25um or 0.18um process nodes. The CA13 platform is the company's third generation of modular process technology, which allows circuit designers the flexibility to choose which process features will best differentiate their products by optimizing design performance, manufacturing cycle time, and ultimately, cost.

The roll-out of the CA13 platform precedes the release of the Jazz SBC13 Silicon Germanium (SiGe) BiCMOS technology that is based upon the RFCMOS process. The SBC13 technology includes a low-cost, 4 mask, SiGe bipolar NPN to combine all of the features of CA13 with the performance advantages of SiGe at low additional complexity. Design kits for SBC13 will be available in the first quarter of 2006.

"RF System on Chip integration for low-cost wireless is a critical component of the growing portable and connected electronics markets. Jazz Semiconductor's 0.13 micron process platform provides an efficient option, enabling RF System on Chip integration," said Joanne Itow, managing director, Semico Research. "The follow-on 0.13 micron SiGe version will further enable circuit designers to achieve higher levels of integration at higher speeds."

The Jazz 0.13 micron process technology is targeted for markets including multi-standard TV tuners and integrated demodulators, cellular and wireless LAN transceivers with digital power control integration and virtually any other design requiring RF or analog System on Chip integration.

"With our 0.13 micron process platform, we are serving analog and RF companies that have an increasing need for low-power digital integration with high-performance analog and RF circuitry," said Paul Kempf, chief technology and strategy officer, Jazz Semiconductor. "The CA13 process and its follow on SiGe BiCMOS version, SBC13, continue to underscore our commitment to enable low-cost, highly integrated analog and RF ICs for next-generation products."

About Jazz Semiconductor

Jazz Semiconductor is an independent wafer foundry focused primarily on specialty CMOS process technologies, including SiGe BiCMOS and RFCMOS for the manufacture of highly integrated analog and mixed-signal semiconductor devices. Jazz's executive offices and its U.S. wafer fabrication facilities are located in Newport Beach. Jazz has expanded its wafer capacity in China through manufacturing partnerships with Advanced Semiconductor Manufacturing Corp. and Hua Hong NEC Electronics Co. Ltd. Contact Jazz Semiconductor at www.jazzsemi.com.