Ingot Announces New Intelligent Switch Interconnect Solution
Ingot Intelligent Switch Interconnect Features
• 20Gbps throughput
• Base Configuration supports interconnecting 4 CPU blades
• Modular and scalable architecture supports 8 and 16 CPU blades
• Blade interfaces are PCI Express 1.1 compliant
• Backplane interfaces are scalable serial interfaces similar to the PCI Express 1.1 specifications
• Intelligent bandwidth management to support low latency data transfer
• Integrated memory manager facilitates access to external DDR2 DRAM
• Support for Quality of Service (Qos) via two priorities per link.
• Supports reliable data transfer across the backplane via data link integrity checks
• Fully customizable via a simple to use local programming interface
• Supports locks in hardware to ease design of multi-host system software
Electronic Design Solutions
Traditional Design Service and IP companies take a ‘one-size fits all approach’ and typically offer a previously completed design (as an IP Core) as a solution to your design. It will require additional time and engineering effort to get it to ‘fit’ your requirements. Ingot has taken a more ‘custom tailored’ approach. We have used our extensive system design experience to create a unique infrastructure that allows us to tailor our target designs to your specific application. We call these design environments Electronic Design Solutions (EDS) Technology.
Ingot can create an Intelligent Switch Interconnect IP Solution optimized for specific applications. Features and capabilities can be added or removed based on the application requirements. If the system requires low-latency our high-performance interface can be used. If the design has a small die size target we can provide a ‘bare bones’ solution with just the right set of features to hit functionality requirements while minimizing die area and power consumption. Many additional customization options are available and can be determined during a detailed requirements review with Ingot engineers. The new Intelligent Switch Interface Solutions Guide contains several example customization options. It is available on the Ingot Systems web site at www.ingotsys.com.
Deliverables
• Verilog netlist
• Encrypted verilog simulation models
• Complete test bench with coverage reports
• Compliance test plan and test bench documentation
• Synthesis scripts
About Ingot Systems
Ingot Systems, Inc. is a premier Electronics Design Solutions company, headquartered in Santa Clara, California with global design centers located in India and the United States. Electronics Design Solutions Technology are an Ingot proprietary technology, which allows us to provide unprecedented levels of customizability, flexibility and quick time to market for our Design Services and IP Solutions.
|
Related News
- Synopsys ZeBu Server 4 Adopted by Xsight Labs for Intelligent Networking Switch Processor
- Arteris IP FlexNoC Interconnect and Resilience Package Licensed by MegaChips for Automotive Ethernet TSN Switch Chip
- Flex Logix Co-Founder Cheng Wang Awarded Interconnect Patent For Tiling of eFPGA Cores to Create Wide Range of Larger eFPGA Arrays
- Sonics' Research Reveals Dramatic Gains in Volume, Market Share, and Profits Using Third-Party Intelligent Interconnect Strategy for SoC Design
- LSI Logic unveils complete platform solution with low-cost, fully integrated StreamPack 24 X 2 intelligent switch
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |