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Intersil files SOI suit against Soitec
Mark LaPedus
EE Times
(11/02/2005 4:40 PM EST)
SAN JOSE, Calif. — Intersil Corp. has filed a suit against France’s Soitec S.A. over alleged infringement of silicon-on-insulator (SOI) patents.
The suit, filed in the U.S. District Court for the Eastern District of Texas on Oct. 27, alleges that Soitec is infringing upon Intersil’s patent using “a rapid thermal process for manufacturing a wafer bonded silicon-on-insulator semiconductor,” according to court documents. The patent involved is U.S. Patent No. 4,771,016.
EE Times
(11/02/2005 4:40 PM EST)
SAN JOSE, Calif. — Intersil Corp. has filed a suit against France’s Soitec S.A. over alleged infringement of silicon-on-insulator (SOI) patents.
The suit, filed in the U.S. District Court for the Eastern District of Texas on Oct. 27, alleges that Soitec is infringing upon Intersil’s patent using “a rapid thermal process for manufacturing a wafer bonded silicon-on-insulator semiconductor,” according to court documents. The patent involved is U.S. Patent No. 4,771,016.
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