Panel studies power in SoCs
(11/04/2005 6:35 PM EST)
NEWPORT BEACH, Calif. — A panel discussion at the 3rd International System-on-Chip Conference here this week attempted to skip past the academic science projects and the rosy vendor marketing and explore what was really feasible today in the challenging area of power management.
The first question the panel attacked was the need for more power management in the first place. Couldn't today's designs get by with standby, sleep, doze and coma modes, like their 180-nm predecessors?
"One sleep mode is not enough any more,” declared David Flynn, engineering fellow at ARM Ltd. "The power demands of applications now require far too many techniques."
On the issue of what to do about the problem, the panel was more divided. Steve Liebson, technology evangelist at Tensilica Inc., for his part, argued that the place to start was with architectural change.
E-mail This Article | Printer-Friendly Page |
Related News
- EnSilica to supply beamforming SatCom ICs to Germany's VITES to enable power- and cost-efficient flat panel terminals for NGSO-constellations
- Synopsys and Samsung Foundry Boost Power, Performance and Area for Modern SoCs on Samsung's SF2 Process
- CEVA and proteanTecs Announce Partnership to Optimize Reliability and Power of Complex SoCs
- 10-bit 3Msps Ultra low power SAR ADC IP core for Wireless Communication and Automotive SoCs is available for immediate licensing
- Vidatronic Releases FlexSIMO™ DC-DC Converter Technology for Highly Efficient Power Delivery in IoT, AR/VR, and Metaverse SoCs
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process