Atmel Announces 0.18um RF CMOS Foundry Process for Low Volume Applications
With Optional EEPROM, On-Chip Aluminum Inductors, 5 or 6 Metal Layers
San Jose, California -- November 9, 2005 -- Atmel(R) Corporation (Nasdaq: ATML), announced today its 0.18 micron AT58900 RF CMOS process technology for ASIC foundry customers whose products require high speed, low power RF devices, such as those used in WLAN, WiMAX and ZigBee applications. This new process is manufactured on 200mm wafers and features 1.8V CMOS transistors and a vast array of passive components that include low tolerance analog poly resistors, N+ and P+ S/D resistors, and up to four metal layers. RF pads are included to help minimize interface impedance.
Optional features include single poly EEPROM for on-chip analog trimming or low density data storage. Minimization of circuit noise can be achieved using optional triple well isolation transistors, low channel-leakage MOS transistors, and isolated NMOS transistors. Other optional features include high Q, low noise metal-insulator-metal capacitors, and P+/N- varactors for optimum linearity. On-chip thick aluminum inductors are available for impedance matching, which reduces off-chip component requirements. Designers have access to fifth and sixth metal layers to help simplify signal routing. A 3.3 volt input/output interface can be incorporated eliminating the need for off-chip voltage doublers.
Multi-project Wafers (MPWs) -- Atmel offers frequent multi-project wafer (MPW) runs that provide an economical means for customers to debug prototype RF devices without purchasing an entire mask set. Multiple customers share the same reticle and wafer-run, thereby reducing the cost of entry. Prices for MPW runs are dependent on the die size.
Production -- Atmel accepts minimum order quantities (MOQ) as low as US$250K per year for production foundry products. All backend services including test, characterization, qualification, design verification, and supply chain management are available if required.
Design Kits -- Atmel offers a wide range of mature design libraries and a Cadence design kit for the AT58900 that supports accurate mixed signal simulation between digital, analog and RF circuits. The digital standard cell libraries are supported in OPUS.
Atmel's 58900 0.18 micron RF CMOS process is available now.
About Atmel
Atmel is a worldwide leader in the design and manufacture of microcontrollers, advanced logic, mixed-signal, nonvolatile memory and radio frequency (RF) components. Leveraging one of the industry's broadest intellectual property (IP) technology portfolios, Atmel is able to provide the electronics industry with complete system solutions. Focused on consumer, industrial, security, communications, computing and automotive markets, Atmel ICs can be found Everywhere You Are(R).
|
Related News
- SMIC Adds New Design Kit for its 0.18um CMOS Process for Use with Agilent Technologies'EDA Software
- UMC First Foundry to Introduce 0.18um 32 Volt High Voltage Process
- Chipidea announces silicon validated analog IP cores in Chartered 0.18um CMOS Process
- Nordic VLSI launches the nRF2402, a highly integrated component for wireless communication manufactured in an ultra modern 0.18um CMOS process
- Impinj Aligns With UMC to Deliver Logic NVM Cores on 0.18um and 0.13um Process Technologies
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |