SIG updates Bluetooth cores roadmap
John Walko, EE Times
(11/25/2005 9:04 AM EST)
LONDON — The Bluetooth Special Interest Group is set to update its roadmap out to the third quarter of 2007, emphasizing interoperability with UWB media-access control (MAC) layers, improved security features, advanced topologies and better quality of service.
The first core release, codenamed Lisbon, is essentially complete and covers the Enhanced Data Rate 2.0 version. This will be released early next year, and according to Mike Foley, Bluetooth SIG executive director, prototyping of devices that meet the specifications should be completed by the second quarter of 2006.
The next core, dubbed Seattle, will be the first to feature the specifications coming down from the agreement with the ultrawideband community that will make Bluetooth technology compatible with UWB.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- CEVA Bluetooth® 5.4 IP Achieves SIG Qualification, Includes New Features to Address Rapidly Growing Electronic Shelf Label (ESL) Market
- Bluetooth SIG Introduces Wireless Standard for Electronic Shelf Label Market
- CEVA's Bluetooth Dual Mode 5.3 SIG Qualified Platform Offers Improved Security, Less Interference and Better Power Consumption for Wireless Audio
- CEVA's Bluetooth Dual Mode 5.2 Platform Achieves SIG Qualification, Expedites IC Design for TWS Earbuds and More
- CEVA's Bluetooth Low Energy 5.2 Platform is First IP to Receive Bluetooth SIG Qualification
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation