NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
Fintronic Announces Super FinSim integrated with SystemC
FOSTER CITY, Calif.--November 30th, 2005-- Fintronic USA, Inc., a leading provider of high-performance Verilog simulators announced support for mixed Verilog/SystemC models, starting with the release of Super FinSim 7_0_0, which is integrated with the OpenSource Initiative's SystemC simulator.
Dr. Alec Stanculescu, CEO and President of Fintronic USA, stated "SystemC is being used more and more by designers of complex circuits and we, at Fintronic USA, are pleased to offer our customers support for simulating mixed Verilog/SystemC models, featuring high speed integration, interface signals with up to 80,000 bits each, and a very simple usage procedure. We are also glad that the Verilog demos available on our WEB site for over 3 years, are running over 10x faster with Super FinSim 7_0_0 than with Super FinSim 6_2_09, the previously latest available version".
ABOUT SUPER FINSIM
Super FinSim is a high performance, robust Verilog simulator, compatible with all the main players in the Verilog market.
Super FinSim's low memory requirement, proprietary swapping mechanism, compact results format, and support for separate compilation, make it ideal for use in large simulation farms.
ABOUT SYSTEMC INTEGRATED WITH SUPER FINSIM
The use of mixed Verilog/SystemC models using Super FinSim and OSCI's SystemC simulator requires just the use of the foreign=SystemC attribute in Verilog modules to indicate that the body of the module is written in SystemC and the -sysc option at compilation to indicate that a SystemC file name follows on the command line.The use of the OSCI SystemC simulator is governed by the open source license agreement (https://www.systemc.org/web/sitedocs/open_source_licensing.html). Absolutely no warranty is made by Fintronic USA regarding the functionality or quality of the OSCI SystemC simulator.
More details regarding the simulation of mixed Verilog/SystemC descriptions by Super FinSim are presented on Fintronic's WEB site in section 5.4 of FAQ: http://fintronic.com/faqtoc.html, as well as in FinSim's User's Guide.
ABOUT FINTRONIC USA
Fintronic USA, Inc.is a technology leader in high-performance Verilog Simulation. The company is committed to develop and deliver high performance simulators that enable customers to verify efficiently the functional and timing correctness of their most complex electronic system designs.
For more information on Fintronic USA, Inc. and its products, visit (www.fintronic.com), contact Dr Alec Stanculescu at (650) 349 0108, or send e-mail to info@fintronic.com.
|
Related News
- Fintronic USA, Inc. announces Super FinSim pre-installed on Monarch Servers from ASL having 32 GB of RAM
- STMicroelectronics Launches New Super-Integrated ARM7-Based Microcontrollers with Full-spec Operation at 3.3Vand 5V
- Aldec Releases Integrated SystemC Debugging Environment with Assertion-Based Verification
- CoWare and Forte Deliver First Integrated SystemC-based Solution For Electronic System Level (ESL) Design to Implementation
- Fintronic Announces Verilog Separate Compilation For FinSim Simulator
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |