English
Intrinsix Corp. Presents at SNUG Israel 2006
Westboro, MA - December 13, 2005 - Intrinsix Corp. is pleased to announce that SNUG Israel 2006 will feature the presentation of "Unified Functional Verification Approach for GPON SoC Application" - a whitepaper written by Baruch "Bruce" Bergenfeld, GM of Intrinsix Israel and Yossi "Joe" Loecher, Verification Engineer for the Israeli Design Centre. SNUG (Synopsys Users Group) is one of the most popular forums for engineering exchanges in the ASIC design community and local technical committees organize annual meetings all over the world. The SNUG Israel meeting, which will be held February 21st, will be the sixth such annual meeting held in Israel.
Intrinsix has been providing ASIC and SoC solutions to the world’s chip and system developers since 1985. With its headquarters in Westboro, MA Intrinsix operates design centers across the US and in Israel. Intrinsix has presented papers and sat on panels at many of the industry's conferences and user group meetings, including previous SNUG meetings.
The paper, presented by Loecher, will highlight the Intrinsix development of a unified approach to functional verification of SoC designs using VERA. This approach starts with generic verification components including Generator, Collector, Scoreboard, BFM and coverage. Then custom scripts are run to customize the environment for the given application. Intrinsix has deployed this approach in an a design application for the new GPON (Gigabit Passive Optical Networking) standard. Intrinsix will show what some of the challenges were using this unified approach for this application and how the issues were overcome.
For more information about the SNUG Israel visit their web site at:
www.snug-universal.org/israel/israel.htm
About Intrinsix
Intrinsix designs and develops complex Application Specific Integrated Circuits (ASICs), System-on-Chip (SoC) designs and Intellectual Property (IP) in digital, analog, mixed-signal and RF technologies. Our customers come from a variety of industries including wireless, networking, consumer electronics, medical, automotive, government, defense and aerospace to name a few. These clients have devices produced by semiconductor vendors such as Texas Instruments (TXN), IBM (IBM), LSI Logic (LSI), Atmel (ATML), TSMC (TSM), UMC (UMC) and Toshiba (TOS.L and 6502.TO) among others. Intrinsix also utilizes industry standard tools from companies such as Synopsys (SNPS), Mentor Graphics (MENT), and Cadence (CDN), among others. The company's lengthy list of successful customers and partners attests to the high quality of its engineering and results-oriented teamwork. For more information visit Intrinsix at www.intrinsix.com
About SNUG
SNUG is an open forum that that provides Synopsys users worldwide with a unique opportunity to exchange ideas, discuss problems and explore solutions. In addition to a highly technical program that focuses on real-world design challenges, each SNUG event includes interaction with Synopsys executives, product developers and applications consultants about future product directions and product and support quality. Each SNUG is driven by a local Technical Committee, with operational support provided by Synopsys. For more information visit their website at www.snug-universal.org
Intrinsix has been providing ASIC and SoC solutions to the world’s chip and system developers since 1985. With its headquarters in Westboro, MA Intrinsix operates design centers across the US and in Israel. Intrinsix has presented papers and sat on panels at many of the industry's conferences and user group meetings, including previous SNUG meetings.
The paper, presented by Loecher, will highlight the Intrinsix development of a unified approach to functional verification of SoC designs using VERA. This approach starts with generic verification components including Generator, Collector, Scoreboard, BFM and coverage. Then custom scripts are run to customize the environment for the given application. Intrinsix has deployed this approach in an a design application for the new GPON (Gigabit Passive Optical Networking) standard. Intrinsix will show what some of the challenges were using this unified approach for this application and how the issues were overcome.
For more information about the SNUG Israel visit their web site at:
www.snug-universal.org/israel/israel.htm
About Intrinsix
Intrinsix designs and develops complex Application Specific Integrated Circuits (ASICs), System-on-Chip (SoC) designs and Intellectual Property (IP) in digital, analog, mixed-signal and RF technologies. Our customers come from a variety of industries including wireless, networking, consumer electronics, medical, automotive, government, defense and aerospace to name a few. These clients have devices produced by semiconductor vendors such as Texas Instruments (TXN), IBM (IBM), LSI Logic (LSI), Atmel (ATML), TSMC (TSM), UMC (UMC) and Toshiba (TOS.L and 6502.TO) among others. Intrinsix also utilizes industry standard tools from companies such as Synopsys (SNPS), Mentor Graphics (MENT), and Cadence (CDN), among others. The company's lengthy list of successful customers and partners attests to the high quality of its engineering and results-oriented teamwork. For more information visit Intrinsix at www.intrinsix.com
About SNUG
SNUG is an open forum that that provides Synopsys users worldwide with a unique opportunity to exchange ideas, discuss problems and explore solutions. In addition to a highly technical program that focuses on real-world design challenges, each SNUG event includes interaction with Synopsys executives, product developers and applications consultants about future product directions and product and support quality. Each SNUG is driven by a local Technical Committee, with operational support provided by Synopsys. For more information visit their website at www.snug-universal.org
|
||||||
Related News
- Tower Semiconductor Receives $20 Million of Cash Investment from Israel Corp.
- Acquisition of Intrinsix Corp.'s Federal Systems Division Expands Abraxas Corporation's Engineering Capabilities
- Comsys Presents ComMAX Solution at the IEEE 802.16 Conference in Israel
- Intrinsix Corp. Joins ARM Connected Community
- Elliptic Semiconductor Welcomes addition of leading Design Services Company – Intrinsix Corp. to Partner Program.
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
|
E-mail This Article | 
|
|
Printer-Friendly Page |