English
Dual Port Register File Compiler (1 Read-Only Port, 1 Write-Only Port)
Stacked SRAM cells support programmable startup
Peter Clarke, EE Times
(12/23/2005 11:15 AM EST)
LONDON — Viciciv Technologies Inc. is a startup company that appears to be preparing to enter the FPGA or programmable ASIC market, using patented stacked SRAM cell technology.
The company has been assigned a patent that appears to cover the construction of an SRAM inverter pair stacked vertically or with the SRAM laid out in single plane stacked on top of logic transistors.
At its website Viciciv (Sunnyvale, Calif.) claimed its goal is to create a “new paradigm for ASIC and ASSP design” It also claimed to have an innovative technology to simplify system design with time to market, ease of use, low cost and high performance ASICs. However, no details are provided at the website.
(12/23/2005 11:15 AM EST)
LONDON — Viciciv Technologies Inc. is a startup company that appears to be preparing to enter the FPGA or programmable ASIC market, using patented stacked SRAM cell technology.
The company has been assigned a patent that appears to cover the construction of an SRAM inverter pair stacked vertically or with the SRAM laid out in single plane stacked on top of logic transistors.
At its website Viciciv (Sunnyvale, Calif.) claimed its goal is to create a “new paradigm for ASIC and ASSP design” It also claimed to have an innovative technology to simplify system design with time to market, ease of use, low cost and high performance ASICs. However, no details are provided at the website.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related News
- Korean Ministry of SMEs and Startups selects Arm Flexible Access to support local startup companies
- Startup Runs AI in Novel SRAM
- Sidense Demonstrates Working One-Time Programmable (OTP) Bit Cells in TSMC 16nm FinFET Technology
- Startup Slashes SRAM Power With Standard Logic Process
- Xilinx Extends Leadership in Avionics with Certifiable, All Programmable Design Solutions and Dedicated Support
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation