V3, Infineon collaborate in design boards for TriCore processors
![]() |
V3, Infineon collaborate in design boards for TriCore processors
By Semiconductor Business News
September 27, 2000 (9:00 a.m. EST)
URL: http://www.eetimes.com/story/OEG20000927S0003
TORONTO--V3 Semiconductor Inc. here today announced a new development board and collaboration with Infineon Technologies AG to support single-board computers with embedded PCI interfaces. V3's new evaluation and reference-design system supports embedded PCI applications using Infineon's TriCore Unified Processor Architecture. The company said the new development board supports TriCore processors running at 66 MHz and V3's Universal System Controller (USC) architecture for embedded PCI designs. A key factor in Infineon's selection of V3's V320USC controller was its direct memory access (DMA) and SDRAM control features, as well as simple interface to the TriCore processors, said Oliver Garreau, TriCore applications engineering manager for the Munich-based company. The V320USC enables the system to operate in one of two modes: stand-alone master mode, withself-boot and plug-and-play capability, or PCI adapter card slave-only mode, said V3 . The new development board, called the TriCore Single-Board Computer (TSBC), can accommodate up to three PCI 32-bit target boards in stand-alone operation. In PCI-target board mode, a 32-bit card edge PCI connector can be used to plug a PC to the board. The PCO TSBC development kit will be available by the end of the year for less than $1,000, including 32 megabytes of SDRAM and 24 megabytes of flash.
Related News
- Infineon, POLYN to Collaborate on Advanced Tire Monitoring Products
- IAR Systems and Codasip collaborate to enable low-power RISC-V based applications
- Andes Technology and Cyberon Collaborate to Provide Edge-Computing Voice Recognition Solution on DSP-capable RISC-V Processors
- Lattice and Infineon Technologies Collaborate to Deliver New Pictor Reference Design Kit
- Aerendir Mobile Inc. and SiFive Inc. Collaborate to Accelerate the Adoption of AI-Enabled Processors
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |