BMW Signs SmartShunt Technology Patent License Agreement With Microchip Technology
CHANDLER, Ariz., Jan. 11, 2006 — Microchip Technology Inc., a leading provider of microcontroller and analog semiconductors, today announced the signing of a patent license agreement with the German auto maker BMW AG. The agreement provides BMW access to Microchip-owned patents covering the use of microcontrollers/microprocessors in battery-monitoring sensors, including conventional 12V vehicles. BMW is a leader in the design and implementation of battery and power-monitoring sensors that track energy use and battery condition in automotive applications.
Microchip acquired the licensed technology as part of the PowerSmart® acquisition in 2002.
Microchip also manufactures key semiconductor components used in power sensors, including voltage regulators, memory chips and advanced microcontrollers needed for data transmission. The integration of digital components with traditional analog current sensors is the subject of the licensed patents.
"The significant growth of electronics in vehicles has created an expanding need for power management in vehicles" said Ganesh Moorthy, vice president of Microchip’s Advanced Microcontroller and Memory Division. "By making the SmartShunt® technology patents available for license, we hope to enable the expanded use of integrated current sensors in all automotive designs. BMW is a leader in the use of this type of sensor, and we expect to see other automakers follow their lead."
About Microchip Technology
Microchip Technology Inc. (NASDAQ: MCHP) is a leading provider of microcontroller and analog semiconductors, providing low-risk product development, lower total system cost and faster time to market for thousands of diverse customer applications worldwide. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality. For more information, visit the Microchip website at www.microchip.com.
|
Related News
- Everspin Signs Long-term Patent License Agreement with Alps Electric
- Rambus Signs Patent License Agreement with Winbond
- Qualcomm Signs 3G/4G China Patent License Agreement with vivo
- Qualcomm Signs 3G/4G Chinese Patent License Agreement with Hisense
- Qualcomm Signs 3G/4G Chinese Patent License Agreement with Yulong
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |