MIPS to take $2 million charge for acquiring Lexra's R&D
MIPS to take $2 million charge for acquiring Lexra's R&D
By Semiconductor Business News
January 4, 2002 (4:02 a.m. EST)
URL: http://www.eetimes.com/story/OEG20020102S0018
MOUNTAIN VIEW, Calif.-- MIPS Technologies Inc. here today announced it will take a one-time charge of $2.0 million for the purchase of in-process R&D from Lexra Inc. as part of a settlement in its patent infringement suit against the San Jose-based company. MIPS said its pro-forma operating results for the company's second fiscal quarter, ended Dec. 31, will result in a net loss of $0.05 per share, before the one-time charge. That estimate is in line with the earnings consensus on Wall Street, according to First Call/Thomson Financial. On late Monday, Lexra announced it was shifting its business model to become a fabless semiconductor supplier and turning over its processor intellectual property (IP) to MIPS as part of the suit settlement (see Dec. 31 story). Lexra will serve communications applications supplying ICs, based on MIPS technology. Mountain View-based MIPS sa id it expects financial results for the second fiscal quarter to be in line with guidance provided at the beginning of the period. The company is scheduled to report its results on Jan. 15.
Related News
- Faraday Reports Third Quarter 2021 Revenues at NT$2,218 Million, Up 31% QoQ
- Mentor Catapult HLS Enables Stream TV's R&D Group SeeCubic to Develop Glasses-Free 3D Digital Display IP
- Interview: Harry Luan, Kilopass' CTO and VP of R&D, Addresses SoC Design Challenges
- Semiconductor R&D Spending to Hit Record-High $53.4 Billion in 2012
- Rebuilding America: Proposals emerge to fix 'dysfunctional' R&D tax credit
Breaking News
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
E-mail This Article | Printer-Friendly Page |