Grace Semiconductor Readies 0.15um+HV for Small Panel Applications
“With the availability of 0.15 um +HV process, we have broadened our HV technology portfolio to service both large panel and small panel applications. Customers have engaged with Grace to design their driver chips with this new technology offering and expect that products should be available to the market as early as Q2/06. Besides 0.15um+HV readiness, we also plan to continue our development efforts in 0.13 um+HV in the near future. Currently, Grace has proven experience in mass production of 0.25 um and 0.18 um HV processes. ” Said Dr. Arthur Kuo, Grace’s Executive Vice President of Worldwide Sales and Marketing.
About Grace Semiconductor Manufacturing Corporation
Grace Semiconductor Manufacturing Corporation (Grace) is a pure IC wafer foundry that specializes in integrated circuit (IC) fabrication. Grace's mission is to become a leading foundry in China by supplying high quality and advanced process technology to domestic and global customers.
Grace is located in Zhangjiang Hi-Tech Park in Pudong, Shanghai, with a total land area of 240,000 square meters. Two fabs, based on 12-inch wafer specifications, have been constructed. Currently, Fab 1A (8") is in full production, having already attained a monthly capacity of 27,000 8-inch wafers at the end 2004. More information about Grace is available at www.gsmcthw.com.
|
Related News
- Oki's 0.15um ARM Core First ARM-based IP to Achieve 0.15um Silicon Verified Silver Status at UMC
- Grace Semiconductor Expands Access to 0.18- and 0.13-Micron Processes With Adoption of ARM Physical IP
- Impinj Delivers Logic Nonvolatile Memory in Tower Semiconductor's 0.13-Micron Process
- Tower Semiconductor Launches 0.18-Micron High-Voltage Technology
- Tower Semiconductor Announces Expansion of 0.13-Micron Manufacturing Capacity With Purchase Commitment by SanDisk Corporation
Breaking News
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
E-mail This Article | Printer-Friendly Page |