Renesas Technology to License 1Gbit AG-AND Technology to PSC
The new agreement further strengthens the working relationship between the two partners. It will allow PSC to sell AND flash memory under its own brand. The agreement will increase the number of available sources for AND flash memory and encourage expansion of the market for such devices, thus providing benefits for customers.
About Renesas Technology Corp.
Renesas Technology Corp. is one of the world's leading semiconductor system solutions providers for mobile, automotive and PC/AV (Audio Visual) markets and the world's No.1 supplier of microcontrollers. It is also a leading provider of LCD Driver ICs, Smart Card microcontrollers, RF-ICs, High Power Amplifiers, Mixed Signal ICs, System-on-Chip (SoC), System-in-Package (SiP) and more. Established in 2003 as a joint venture between Hitachi, Ltd. (TSE:6501, NYSE:HIT) and Mitsubishi Electric Corporation (TSE:6503), Renesas Technology achieved consolidated revenue of 1002.4 billion JPY in FY2004 (end of March 2005). Renesas Technology is based in Tokyo, Japan and has a global network of manufacturing, design and sales operations in around 20 countries with about 26,000 employees worldwide. For further information, please visit http://www.renesas.com
|
Related News
- Renesas Strengthens IP License Portfolio with IP Utilities to Facilitate Device Development
- Rambus and Renesas Electronics Renew License Agreement
- Renesas Electronics and Renesas Mobile License ARM Processor IP for Next Generation Communications Processors and Application Processors
- Tensilica's ConnX BBE16 DSP IP Core for Digital Baseband Signal Processing Licensed to Renesas Electronics
- Renesas Electronics and Renesas Mobile License Imagination Technologies' PowerVR Series6 Graphics Technologies
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |