Celoxica Strengthens DSP-FPGA Solutions Joins Texas Instruments Third Party DSP Program

Celoxica ESL Design Technology Bridges Design Gap Between DSP and FPGA Provides Direct Path From Software To Silicon

Oxfordshire, UK — February 20, 2006 — Celoxica (AIM: CXA) today announced that it is joining the Texas Instruments Incorporated (TI) TMS320™ third party program and will present its DSP-FPGA design solutions during the 2006 TI Developer Conference (TIDC) in Dallas, Texas.

Celoxica’s industry leading electronic system level (ESL) technology provides a C-based design and synthesis flow for DSP-FPGA system development. It leverages API specifications for DSP-FPGA communication and allows creation of applications and IP to a single set of standard interfaces independent of board level detail. Celoxica’s design solutions support other popular design environments such as TI’s Code Composer Studio™ Integrated Development Environment, Mathworks' Simulink, and Diamond from 3L.

“The C-based design flow for software and the programmable hardware components of a system broadens the reach of DSP based solutions containing FPGA technology. Celoxica’s design solutions enhance the development experience of our customers who need to reduce design time and accelerate complex algorithms,” said Jennifer Skinner-Gray, worldwide DSP partner network manager, TI.

Presenting in the TIDC Systems track, Celoxica will demonstrate how hardware, software and systems developers can overcome the traditional DSP and FPGA design barrier by combining C-based design with model-based design. Initially focusing on image processing and software defined radio (SDR) systems development, the flow from algorithm to implementation will be shown and complementary use of DSP and FPGA will be discussed along with the characteristics of board level platforms.

“More and more developers are using our DK Design Suite to accelerate complex algorithms and signal processing in mixed DSP/FPGA systems,” said Jeff Jussel vice president worldwide marketing for Celoxica. “Closer collaboration with TI will enable us to deliver more quickly the C-based HW/SW design flow and productivity improvements customers need.”

About the Texas Instruments Third Party Program

Celoxica is a member of TI's TMS320™ third party program, the most extensive collection of global DSP development support in the industry. With more than 650 independent companies and consultants, TI's customers have easy access to a broad range of application software, development hardware and software and consulting services. For more information on the TI third party program, please visit www.ti.com/3p.

About Celoxica

A leader in electronic system level design (ESL), Celoxica is enabling the next generation of advanced electronic products by producing tools, boards, IP and services that turn software into silicon. Celoxica technology raises design abstraction to the algorithm level, accelerating productivity and lowering risk and costs by generating semiconductor hardware directly from C-based software descriptions. Adding to a growing installed base, Celoxica provides the world’s most widely used C-based behavioral design and synthesis solutions to companies developing semiconductor products in markets such as consumer electronics, defense and aerospace, automotive, industrial and security. Celoxica is a publicly traded company on the Alternative Investment Market of the London Stock Exchange under the symbol CXA.

About the Texas Instruments Developer Conference

The 2006 TI Developer Conference (TIDC) features the latest in high-performance digital signal processing, high-performance analog and microcontroller system designs. TI CEO Rich Templeton will be joined by industry leaders, embedded designers, engineers, project managers, educators and other TI executives from around the world for the conference, held from February 28 – March 2, 2006 at the Hyatt Regency in Dallas, Texas. Including keynote speakers, technical presentations and live demonstrations, the conference offers intensive learning and hands-on interaction with cutting edge products to empower the development of the next-generation of video, audio, communications and control applications. For more information, visit www.ti.com/tidc2006.

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