Texas Instruments Releases Advanced ASIC Kits, Extends ASIC Library and Support for Design Tools
With this release, TI announces extended support for commercially-available design synthesis tools. Moving forward, TI now accepts hand-offs generated by Cadence, Magma or Synopsys commercially-available synthesis tools to provide TI customers with the additional flexibility to release netlists generated by their preferred tools.
"TI's customers have always had access to world-class process technologies through our standard cell libraries and design kits," said Steve Sutton, vice president of TI's ASIC business unit. "Our ASIC customers now also have multiple ways to generate and provide us with their netlists, ensuring they can select from among the best EDA solutions when driving entitlement from those TI process technologies. We have seen internal TI design teams make great use of this flexibility, and we are pleased to offer our external customers the same flexibility."
TI is a leader in developing and marketing advanced ASIC semiconductor technology solutions, and supporting customers with its largest and most complex designs. TI leverages its advanced semiconductor process technology, embedded intellectual property (IP) including high performance, lower DSP architectures, advanced packaging and ASIC design kits to meet customer design targets in a variety of end applications.
|
Related News
- CriticalBlue releases support for Texas Instruments' TMS320C66x multicore DSPs within Prism
- UMC Obtains Advanced Process Tools through Texas Instruments
- Imperas releases new updates, test suites, and functional coverage library to support the rapid growth in RISC-V Verification
- AST SpaceMobile Selects EnSilica to Support the Development of its Next Generation Advanced Cellular ASIC Chip
- Green Hills Software Adds Industry-Leading Advanced Software Development Tools Support for RISC-V
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |