English
TSMC 4nm (N4P) 1.2V/1.8V Basekit Libraries, multiple metalstacks
ARM's chairman calls for collaboration
Dylan McGrath, EE Times
(03/13/2006 2:42 PM EST)
SCOTTSDALE, Ariz. — The old methods for product design and development do not scale in an era when market windows are shrinking rapidly and electronics markets are being driven by fashion and style, according to Robin Saxby, chairman of ARM Holdings plc.
Delivering a keynote address at the 9th Annual Semico Summit here Monday (March 13), Saxby said solving present and future yield challenges requires collaboration between intellectual property (IP) vendors, EDA tool suppliers and chip makers.
"The only way we resolve these issues as an industry is we have to work together," Saxby said. "We need collaboration and standards. We need to share information and knowledge."
(03/13/2006 2:42 PM EST)
SCOTTSDALE, Ariz. — The old methods for product design and development do not scale in an era when market windows are shrinking rapidly and electronics markets are being driven by fashion and style, according to Robin Saxby, chairman of ARM Holdings plc.
Delivering a keynote address at the 9th Annual Semico Summit here Monday (March 13), Saxby said solving present and future yield challenges requires collaboration between intellectual property (IP) vendors, EDA tool suppliers and chip makers.
"The only way we resolve these issues as an industry is we have to work together," Saxby said. "We need collaboration and standards. We need to share information and knowledge."
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related News
- Synopsys and Arm Extend Collaboration to Fusion Compiler to Accelerate Implementation of Arm's Next-Generation Client and Infrastructure Cores
- Synopsys and Arm Extend Collaboration to Fusion Compiler to Accelerate Implementation of Arm's Next-Generation Client and Infrastructure Cores
- Synopsys and Arm Extend Collaboration to Improve Power, Performance, and Time to Results for Arm's Latest IP and Synopsys Tools
- Linaro Announces Fujitsu's Collaboration to Accelerate High Performance Computing on ARM
- Cadence Expands Collaboration with ARM to Accelerate Custom SoC and IoT System Designs with Industry's First End-to-End Hosted Design Solution
Breaking News
- VSORA Raises $46 Million to Bring World's Most Powerful AI Inference Chip to Market
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
Most Popular
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- CFX 0.13μm eFuse OTP IP has been applied in the mass production of over 15,000 CMOS image sensors
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications