English
ST expands China reach with HHNEC
Mark LaPedus, EE Times
(03/13/2006 3:04 PM EST)
SAN JOSE, Calif. — Chinese silicon foundry specialist Shanghai Hua Hong NEC Electronics Co. Ltd. (HHNEC) continues on its quest to build a 300-mm fab and is reportedly working with a new and surprising partner: STMicroelectronics Inc., according to an analyst.
Under the plan, STMicroelectronics (Geneva), which is expanding its reach into China, will transfer its 300-mm copper technology to HHNEC (Shanghai), according to a new report from Piper Jaffray Inc., an investment banking firm.
For some time, HHNEC, a joint foundry venture between Japan’s NEC Corp. and the Chinese government, has been making chips on a foundry basis within its aging 200-mm fab in Shanghai. In recent times, HHNEC said it has been planning to build a 300-mm fab as well.
(03/13/2006 3:04 PM EST)
SAN JOSE, Calif. — Chinese silicon foundry specialist Shanghai Hua Hong NEC Electronics Co. Ltd. (HHNEC) continues on its quest to build a 300-mm fab and is reportedly working with a new and surprising partner: STMicroelectronics Inc., according to an analyst.
Under the plan, STMicroelectronics (Geneva), which is expanding its reach into China, will transfer its 300-mm copper technology to HHNEC (Shanghai), according to a new report from Piper Jaffray Inc., an investment banking firm.
For some time, HHNEC, a joint foundry venture between Japan’s NEC Corp. and the Chinese government, has been making chips on a foundry basis within its aging 200-mm fab in Shanghai. In recent times, HHNEC said it has been planning to build a 300-mm fab as well.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
|
||||||
Related News
- Codasip Expands its Global Reach by Signing Channel Partnerships throughout Asia
- Thalia expands footprint in China with appointment of Business Partner Fionn Liu
- Expedera Expands Global Reach with New Regional Design Centers and Chinese Langauge Website
- Palma Ceia SemiDesign Expands Asia Team, Names Bo Liu Senior Director of Engineering in China
- China's Semiconductor Fab Capacity to Reach 20 Percent Worldwide Share in 2020
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation