Mark LaPedus, EE Times(03/13/2006 3:04 PM EST)
SAN JOSE, Calif. — Chinese silicon foundry specialist Shanghai Hua Hong NEC Electronics Co. Ltd. (HHNEC) continues on its quest to build a 300-mm fab and is reportedly working with a new and surprising partner: STMicroelectronics Inc., according to an analyst.
Under the plan, STMicroelectronics (Geneva), which is expanding its reach into China, will transfer its 300-mm copper technology to HHNEC (Shanghai), according to a new report from Piper Jaffray Inc., an investment banking firm.
For some time, HHNEC, a joint foundry venture between Japan’s NEC Corp. and the Chinese government, has been making chips on a foundry basis within its aging 200-mm fab in Shanghai. In recent times, HHNEC said it has been planning to build a 300-mm fab as well.
Click here to read more ...